This is a test Fixture for a RF module using RTI’s 2000 Mini-ll Patch Panel universal RF test platform. The fixture is fully RF shielded and modular in design allowing easy replacement of DUTs. The Patch Panel is a unique patent-pending interconnect solution for test and measurement applications. Its highly flexible and modular interface allows the same bench or “rack and stack” test equipment to be used for a wide variety of devices or modules without a complete tear down and re set up.

Modules

RTI offers a variety of patch panels in the RTI-2000 line. The Mini-II patch panel is a typical configuration, with two RF modules (top and bottom), two high-speed digital modules (toward center left and right), and four standard digital/power modules (toward edges left and right). Up to a total of eight modules can be used with a single base unit. The Mini-II provides fast and reliable reconfiguration for the most mixed-signal semiconductor devices and hybrids using a modular approach to mix RF, standard digital, high speed digital, and power signals.

Cables attach to the bottom side of the patch panel, out of the way, and can be routed to the test equipment through an opening in the back side of the base. RTI offers a wide variety of connectors, including SCSI, VME, RJ11, and USB.

Digital and power modules can have up to 180 connections. Digital modules typically have up to 72 signal pins, with the rest of the pins connected to ground. High current power modules are also available. RF modules typically have one to eight high-frequency RF connectors.

Performance Boards

Performance boards are configured for each type of UUT (unit under test), and are easy to replace. They consist of a custom printed circuit board (the DUT board) mounted on a frame for rigidity and plugged onto the patch panel base. The example at left shows the rigid frame, DUT board, and a BGA socket. RTI can design your performance boards, or you can design them yourself.

Digital Modules (Low Speed)

Standard digital patch panel modules are fully assembled, with connector and pogo pin block. Only the pogo pins required for connections will be loaded in the pogo pin block. The block has three sections of 5 x 12 pins (60 pins) on 0.100 in centers. Dedicated ground pins are used as required for performance. The support block is anodised aluminium to prevent any flexing of the module. The interconnect is a rigid-flex PCB, gold plated and controlled impedance when required. Maximum signal length is 1.5 inches.
Modules are aligned to the module support block using two alignment pins and held in place using four 4-40 socket head screws. The modules can be assembled from the topside of the patch panel.

Digital Modules (High Performance)

The high speed Digital Module is designed to accept up to three Molex 74059 connectors. The connectors are pressed into a .125 thick gold plated PCB with plated through holes High performance pogo pins contact the top of the PCB. Up to 60 signal pins per connector can be used for a total of 180 signal pins per module. RTI also offers a high speed 50 ohm coaxial ribbon cable interface totaling 96 signal pins.