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Home > IC Test Sockets > Semi-Custom Sockets > 900-1133 QFN

900-1133 Leadless Test Socket


900-1133

RTI's 1133 standard test socket
Socket Features and Options - Get a Quote
Dimensions: 1.5in x 1.5in
Applications: FA / Engineering / Production
Floating Base: No
Backside Test: based on package
Heated Base: based on package
Max Package Size: 22mm
Package Types: Leadless / Leaded / Balled
Lid Styles: 1, 2, 3, 4
Common Packages:  
Our most common socket, capable of handling almost every package type. It's large enough to handle backside and topside analysis. It's good for testing both IC Packages, and small PCB. This socket accommodates the widest variety of lids and handles the widest variety of test conditions.




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