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Failure Analysis

Failure analysis is an area where RTI has a great many solutions.  FA interconnect solutions have always been at the core of RTI’s business model. The MultiTrace and MegaTrace are considered the gold standard for Failure Analysis nondestructive electrical analysis and are used by most of the large semiconductor companies.
 
  • Device Sockets with FA Features
    • Open Top/Open Bottom
    • Window Lids
    • Device heaters
    • "Dead bug” sockets hold inverted devices for backside analysis
    • Low profile lids for SIL Lens clearance
    • Universal BGA and CSP sockets save money
  • DUT Boards with FA Features
    • Cutouts for open bottom
    • Connector interfaces for RTI cable and switch box interface
    • Pogo interface like RTI mini cards
    • Low profile for microscope clearance
    • Breakout boards for bench testing
  • Test Fixtures for mounting DUT boards in a variety of situations
    • Microscope mount upward and downward looking
    • Probe station mount
    • Spring pin fixture bases
    • High pin count fixtures
  • Cables and extenders for Fault Localization microscopes
    • RTI 96 and 100 pin “YAM Cable” system
    • PGA extension cable for MultiTrace
    • Octopogo Extension Cable for MegaTrace
    • RTI R1 and R4 DUT boards for direct use in microscope
  • FA Friendly Docking Systems for ATE
    • Credence D10
    • Hi Level Functional Tester
    • Verifier MK series compatible fixtures
  • Automatic Curve tracing Systems for characterization and Fault localization