Customizable Burn-In and Test Socket Solutions
These aren't your typical injection molded burn-in and test sockets. RTI's line of machined Burn-In and test sockets offer higher performance, a greater level of customization, longer lifespan and shorter lead times than most manufacturers.
Available for BGA, QFN, QFP, LGA, TSSOP, CSP, WLCSP, SOIC and most other package types from 1.0mm to 35mm and from 0.4mm to over 1.27mm pitches. RTI's compression mount burn-in and test sockets are a high performance, low cost, semi-custom machined alternative to injection molded burn-in sockets. These reliable test sockets use a clam-shell lid design with a floating z-axis pressure plate allowing for tolerances in package thickness. The sockets use new high performance and innovative flat pin technology for 0.4mm, 0.5mm and larger pitch devices. Multiple types of pins are available for the sockets depending on test requirements. The highest performance pin provides a bandwidth of up to 30GHz @ -1db with a current capacity of 3.0A. Lower cost pins are available for DC burn-in applications. The pins have a high spring force suitable for lead-free packages.
Design Features
- Built in clam-shell lid design with floating z-axis pressure plate allowing for tolerances in package thickness
- Low/Medium/High performance pogo pins
- Pogo pins with high spring force suitable for lead-free packages
- Package pitches as low as 0.4mm
- packages with irregular pin position
- Accomodating BGA, LGA, MLP, QFP, QFN, TSSOP, WLCSP, CSP, PLCC, die level, and many more package types
- Heatsinks can be built into lid or socket base
- High performance plastics for base material
- Anodized aluminum lids
- Compression Mount Technology
- Multiple test sites per socket
- No tooling costs
- Lifespan > 25,000 insertions
Electrical Performance
- Up to 30Ghz at -1db loss
- Current capacity of 3A
Dimensions
- Model shown at right: 1.1 x 1.46 x .47 inches (excluding latch)
- Custom footprints available
Temperature Rating
- -55°C to +155°C limited by type of pogo pin
Multi-Site and Complete Burn-In Solutions
Custom Hybrid Socket & burn-in board
download photo sheet
This system was designed to dynamically burn-in a custom multi-chip module with over 200 I/O on 0.8mm pitch. The custom RTI socket contains a heat sink that attaches to a larger heat sink on the back side of the burn-in board. The dual latch clip-on lid has an adjustable pressure plate using a brass machined knob for heat dissipation.
download photo sheet
RTI designed both the sockets and static burn-in board for custom hybrid modules. Each socket holds 10 modules and has a common lid with individual floating pressure plates.
Three Site Leadless Test Socket for Burn-In and Test
Multi-Site test sockets may be available for small packages of any type. A single socket can be designed with multiple pocket sizes, allowing for the test of multiple packages. The materials used are the same as the the clamshell option at the top of this page, however, the lids are seperate from the body offering more versitility on and off of a burn-in test board.