Test Sockets For ICs & Other Packaged Devices

For over two decades RTI has been a leading supplier of standard, semi-custom and fully custom test socket solutions for Failure Analysis, Burn-In Test, Engineering Test, and Production & handlers. Most of these test sockets are compression mount and can be designed to fit your existing PC Board footprint if necessary.
What Makes Us Different
We excel at providing solutions for unique package types in addition to many standard packages including CSP, LLP, QFN, QFP, PQFP and BGA with pitches as low as .27mm and over 2,300 pins.
What You Can Expect
Attention to detail, prompt and friendly service from a knowledgeable team of experts, and competitive prices for long lasting, high quality products.
Test pins / Spring pins / Pogo pins
RTI has a major advantage over many companies that manufacture their own test pins. RTI can select test pins from several qualified manufactures to meet most electrical requirements. In many cases, the pins are designed by RTI to meet our own specification and quality standards. Most of our socket series are designed to accept a variety of test pins. We have pins for high current, lead-free, low inductance, high frequency, different pitches, different lengths, and other features.
Socket Materials
RTI uses materials that best meet the customs requirements. Our standard materials include EESD PEEK, TORLON 5530, TORLON XXXX, ULTEM, Anodized Aluminium, Stainless Steel and more. We will also manufacture sockets using materials that will meet other non-standard requirements.
Temperature Ratings
Most standard sockets are designed for moderate temperatures ranging 0°C through 70°C, however, RTI can design sockets rated for temperatures between -50°C up to 150°C.
Test Socket Solutions We Have Developed In The Past:
- Strip Testing of CSP and LLP Packages
- Kelvin Testing (two probes per pkg. pins)
- Optical Packaged Devices
- Hearing Aids
- Implant Medical Hybrids
- RF Modules and Devices Over 10Ghz
- Multi-Chip Modules
- Silicon-on-Silicon
- Packages With Test Pads on Both Top & Bottom
- Packages Mounted on 35mm Flex Circuits
- Hybrids
- Sockets With Heat Sinks and Other Mechanical Obstructions
- Sockets With Internal Filter Caps or Other Passive or Active SMT Devices