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Low Profile, Open Top

RTI's anodized aluminium or steel lids are ideal for failure analysis, EMMI, and micro probing techniques. These lids offer physical and optical access to the topside of the DUT. They make contact to the perimeter of the package leadframe on the DUT or pcb module.  The minimal overall thickness of these lids make them great when you need to get close to the topside of your device during inspection.
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