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Robson Technologies Inc. now offers direct device cooling capabilities with TEC (Peltier) style lids.

Dec, 31 2012
Robson Technologies Inc. now offers direct device cooling capabilities with TEC (Peltier) style lids. Test sockets with air cooling or liquid cooling lids will take your device under test (DUT) to below 0°C. The liquid chiller will allow for testing up to four channels simultaneously at four individual cooling temperatures. Standardized thermal head footprints up to three inches 3" and custom mounted footprints are available. See the device level IC temperature test thermal heads here: Geotest registration page.
 
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