Robson Technologies, Inc.

RTI specializes in providing test fixtures for unique semiconductor and hybrid packages. Our fixtures typically include a custom designed socket and a custom PCB for interfacing to customer supplied test equipment. RTI can provide fixtures featuring many custom requirements such as: active electronics, specialized mechanical interfaces, pneumatic placement, multi-cavity sockets, and multi-position fixtures with active switching circuitry.

RTI is experienced in designing test fixtures for the following applications:

Product Photo Gallery

RTI 950-096: Example of RTI's standard 950-096 pogo pin fixture modified to hold a custom daughter card that allows some RF measurments on a hyrid RF module.

Custom Hybrid Socket and DUT board: This socket is designed to test a custom multi-chip module with over 200 I/O on 0.8mm pitch. The socket also contains a heat sink that attaches to a larger heat sink on the back side of the DUT board. The dual latch clip-on lid has an adjustable pressure plate using a brass machined knob. The DUT board is 12 layer 50 ohm controlled impedance and interfaces the DUT to SMA, digital, and power connectors. This is part of a project that also included burn-in boards and associated drive electronics for testing during the burn in.
Custom Break-Out Fixture for 97 pin CSP: This fixture includes an RTI custom 97-pin 0.5mm pitch CSP production socket with an open-top FA lid (not shown) for microprobing. The fixture is used for DC and low frequency analysis.
Open Top BGA socket and Daughter Card for Failure Analysis: The socket is for a 0.5mm pitch BGA device. The clip-on open-top lid has an adjustable pressure plate to allow microprobing. The impedance-controlled daughter card interfaces to an RTI pogo ring designed for up to 384 signals, power, sense lines and grounds.
Socket and fixture for testing a ceramic hybrid module and flex circuit for a space satellite. Test points on the ceramic are randomly placed on a pitch as small as 0.5mm.
This system allows the HiLevel test system to be used for testing under a probe station, in a black box, EMI, and other remote locations from the HiLevel. All 512 channels are available from the HiLevel test system. The interface between the HiLevel test system and the daughter card fixture is through controlled impedance ribbon cable and pogo pin connectors. The daughter card fixture is designed to set on a wafer chuck for probing or upside down on an EMI system. Daughter cards (DUT boards) are 6.5 x 8.0 inches. The daughter cards interface directly to the pogo pin cables. Loop-back boards are available for system set up and test. The HiLevel interface DUT board plugs directly into the HiLevel. Handles on the DUT board make removal easy.
This production test fixture included a switch matrix and a custom test socket for a 32 BGA device.
RTI designed and manufactured 50 of these test systems for a hand-held communications device. Contact to the unit under test was made through pogo pins which went through small holes in the plastic base. The test box contained active electronics to interface to the customers test equipment.
This customer required that a test socket be mounted to an existing PCB with no existing mounting holes. RTI designed a surface mount socket for the MCM and a clamp to hold the socket on the PCB while still allowing access to all the required connectors on the PCB.
This ten-up fixture was designed to test medical hybrids. Test pads were located on both the top and bottom of the ceramic hybrid. Multicolor LEDs indicate which hybrid was being tested and the status of each unit ( good, bad, under test, not tested).
Test socket for a silicon-on-flex circuit with probes on 0.5mm centers. Socket was al so designed with a through-hole adaptor with active electronics and mating socket receptacle.
Ten-up test socket and test system for high speed optical interface modules. The test system tested 10 units in parallel. The test box was microprocessor controlled and tested for opens and shorts between all pins.
This fixture is designed for back side test of a 117 BGA package. RTI can supply fixtures for back side test of most package types.
This fixture was design to perform liquid crystal analysis at the wafer level using a probe station and a hot chuck. The fixture includes a pogo ring interface to the probe cards, custom probe cards, and interface to 34 pin headers as will as all the mechanical interfaces.