Robson Technologies, Inc.

RTI designs and manufactures a large variety of sockets to test integrated circuits and hybrids. The company focuses on providing solutions for unique package types in addition to many standard packages including CSP, LLP, QFN and BGA. RTI has designed and manufactured sockets for 0.3, 0.5, 0.8, 1.0, 1.27mm and larger pitch packages with pin counts ranging from 3 to 1,400 pins.

Product Photo Gallery

RTI 900-1173: A series of sockets specifically designed for auto-handlers.
Custom lid: A custom lid was designed to fin on an RTI socket for testing an RF hybrid module with an RF output on the top of the module. A coaxial pogo pin probe is mounted in the lid of the socket and contacts the RF output of the module.
Custom socket and lid for testing a optical sensor packaged in a 121-pin BGA package: The lid is designed to hold various sizes of lenses. An adjustment in the lid allows the lens to be positioned over the sensor portion of the die. The socket base is designed with a floating base so that the balls of the DUT align to the socket base prior to engaging with the pogo pins.

Custom Hybrid Socket and DUT board: This socket is designed to test a custom multi-chip module with over 200 I/O on 0.8mm pitch. The socket also contains a heat sink that attaches to a larger heat sink on the back side of the DUT board. The dual latch clip-on lid has an adjustable pressure plate using a brass machined knob. The DUT board is 12 layer 50 ohm controlled impedance and interfaces the DUT to SMA, digital, and power connectors. This is part of a project that also included burn-in boards and associated drive electronics for testing during the burn in.
Test socket for a silicon-on-flex circuit with test pads on 0.5mm centers: The socket was designed incorporating a multi-layer PCB through-hole adaptor with active electronics and a mating socket receptacle.
Test socket for a CMOS imaging device in a ceramic package with a glass top: The device was required to be tested "dead bug" (pads-side up). The socket lid contains a PCB to route the interconnect to additional pogo pins which then contact to the socket base. The socket base is through-hole with a mating receptacle.
A 28-pin QFN test socket for failure analysis micro probing and back side test (notice hole in center of socket base).
16 + 8 ground 0.5mm pitch QFN production socket using high-force pins to test lead-free packages.
Dual site 14 lead 0.5mm pitch LCC socket for strip testing. RTI has designed many versions of this socket for various pin counts.
RTI/Plastronics FA socket with low-profile lid for micro probing. These sockets are available for up to 96 leads. RTI is also a distributor of Plastronics standard QFN burn-in sockets.
Socket with adjustable dual latch clamshell lid for high pincount BGA packages.
Bottom side of a 40 + 64 ground 0.5mm pitch RF socket showing pockets for components that can be placed less than one mm from the test pins. The pins are very short and low inductance (RTI L4-311 pin).
1024 BGA 1.0mm pitch universal socket with an adjustable lid and alignment plates for devices from 10mm to 35mm square. These sockets are available for 0.5, 0.8, 1.0 and 1.27mm pitch. Other pin counts and sizes are also available.
12-pin RF socket with a gold-plated copper heat sink for the ground connection to the DUT board. This socket was designed for a high powered RF amplifier which required the socket to dissipate heat as well as provide an excellent electrical ground.
This BGA socket is for a very fine pitch silicon die with 128 balls on 0.20mm pitch.
28-pad engineering/production test socket for a PCB hybrid.
48-pin LQFP 0.5mm pitch production test-socket incorporating a floating base and high-force pins for lead-free packages.
32 +16 ground LCC 0.5mm pitch RF socket with RTI's L4-311 low inductance pins. Pockets are provided under the socket for placing components next to the test pins.
Custom socket and fixture for testing a ceramic hybrid module and flex circuit for a space satellite. Test points on the ceramic were randomly placed on a pitch as small as 0.5mm. RTI provided the test sockets and fixtures for testing the completed module as well as the ceramic substrate before assembly.
Test socket for a silicon-on-silicon multi-chip module BGA with 278 balls on a 1.0mm pitch.
Our largest open-top socket with a clam shell lid we have made to date. This through-hole pogo-pin socket was designed to test a ceramic hybrid containing optical devices. The ceramic substrate is approximately 10 inches long and one inch wide. An insert is provided to compensate for two different thicknesses of ceramic.
High-current Kelvin socket with an internal PCB containing filter capacitors and an RF monitoring point. The high current probes are rated for 20 amp with 3 amp Kelvin probes on three of the test points. The socket is designed for use with a dual latch lid.
Quad-Site 32-pin plus 25 grounds socket for strip testing. This socket is designed for testing packages prior to sawing apart. An alignment plate is provided for setup using a dual-latch lid. The lid has individual spring loaded pressure plates. A backing plate was provided for the back side of the DUT board. High pin force test pins were used for lead-free packages. Sockets are available for all pin counts and for lead free and leaded packages.