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Failure Analysis

  • Failure Analysis Heated Test Socket and Temp Controller
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    PCB module test socket with heatsink for Failure Analysis

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    Heater blocks for custom failure analysis test socket NiCu Nickel Plated Copper Block

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    Failure Analysis open top clamshell PGA CMOS Image Sensor test socket

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    Custom test sockets with sapphire glass lid for EMMI inspection can be smaller than a penny

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    Thermocouple integrated test socket with additional pogo pins for heat dissipation

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    Thermal test sockets and active heating lid for high power BGA devices

Robson Technologies, Inc. (RTI) offers numerous solutions for failure analysis testing. Failure analysis interconnect solutions have always been the core of our product line.

Device Sockets with FA features

  • Open Top/Open Bottom
  • Window Lids
  • Device heaters
  • “Dead bug” sockets hold inverted devices for backside analysis
  • Low profile lids for SIL Lens clearance
  • Universal BGA and CSP sockets save money

DUT Boards with FA features

  • Cutouts for open bottom
  • Connector interfaces for RTI cable and switch box interface
  • Pogo interface like RTI mini cards
  • Low profile for microscope clearance
  • Breakout boards for bench testing

Test Fixtures for mounting DUT boards

  • Microscope mount upward and downward looking
  • Probe station mount
  • Spring pin fixture bases
  • High pin count fixtures

Cables & Extenders for fault localization microscopes

  • RTI 96 and 100 pin “YAM Cable” system
  • PGA extension cable for MultiTrace
  • Octopogo Extension Cable for MegaTrace
  • RTI R1 and R4 DUT boards for direct use in microscope

FA-Friendly Docking Systems for ATE

  • Credence D10
  • Hi Level Functional Tester
  • Verifier MK series compatible fixtures
 

Contact RTI for Complete Failure Analysis Solutions

Whether you need a curve tracing system, custom test sockets, or another innovative failure analysis solutions, RTI is the single-source provider you need. Request a quote.

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