Not your average burn-in socket
RTI’s IC and CSP burn-in test sockets are a robust and high-performance machined alternative to injection molded sockets. These compression mount test sockets use pogo pins or elastomeric contacts, so their solderless design allows them to be used for hand tests with other DUT boards. A copper heatsink and thermocouple integrate into the lid or socket body, providing additional thermal dissipation with more accurate device-level temperature monitoring at each test site.
High degree of design and customization
Reduce the cost of ownership with a custom test socket that goes above and beyond burn-in. The test socket example below shows a combination of design options that offered a-la-carte. Actual design options available vary based on the DUT’s attributes such as physical footprint, electrical performance requirements, test point positioning, and package fragility. Contact an RTI engineer today to discuss design options for your specific project.
- Temperatures from -55C to + 150C
- Contact force: 25-40gms
- Long lifespan and insertions
- High current options available
- High-performance plastics and aluminum
- Small footprint to maximize sockets per board
- Fast standard turnaround, expedites available