BURN-IN TEST SOLUTIONS

Robust machined and molded test sockets that can perform in extreme temperatures and humidity to qualify any packaged IC, bare die, or custom module device.

BURN-IN SOCKET DESIGN

Highly Accelerated Stress Test (HAST) is a common reliability test process that goes above and beyond the traditional Temperature/Humidity/Bias (THB) burn-in test process.  HAST testing can yield results in 1/10th of the time but also requires faster ramp up and cool down times in higher temperature, pressure, and humidity ranges.  Not every test socket is suitable for this type of testing. 

Not Your Average Burn-In Test Socket

Our test sockets are built with high-performance materials and electrical contacts capable of meeting THB and HAST test requirements to ensure reliable and accurate results. Every complete burn-in socket and board solution is developed specifically for the device or module under test and verified in-house before shipment so they are ready to go; out of the box and into the oven.

RTI offers validation testing of all completed Burn-in board installations at the individual socket level and overall board level. Using custom manufactured shorting blocks that match the footprint of the DUT, RTI can quickly perform continuity tests of each signal in every socket. Benchtop signal verification testing is performed on boards with passive components such as resistors, diodes, and capacitors. Each burn-in board is tested at the edge connector to ensure board functionality at the system level.

Burn-in and test sockets for custom packages can incorporate a variety of design options that make them useful in and out of the oven. from floating bases to open-top lids, multiple test sites to varying device sizes, the inclusion of thermocouples, airflow channels, and more.

Contact an Engineer

Maximum Volume – Maximum Flexibility

  • Relief cutouts in test socket bases provide clearance for surface mount components placed close to each test site.
  • Tethering GND pads or signal pads of choice together allow for higher pin counts and higher density burn-in solutions.
  • Increase number of sites per socket and sockets per board
  • Custom footprints for most efficient use of space

Custom Devices – Custom Designs

  • Monitor, control, and regulate DUT temperature per test site
  • Improved airflow with channels in socket base and lid
  • Openings in socket base and lid for forced air or DUT access
  • Additional contacts to GND pad on some IC packages
  • Single and multi-site loading of devices maximize real estate
  • Electrical contacts to top and bottom of DUT during test
  • Relief cutouts in socket base provide component clearance
  • Replaceable inserts align packages with large tolerances

Maximum Volume – Maximum Flexibility

  • Relief cutouts in test socket bases provide clearance for surface mount components placed close to each test site.
  • Tethering GND pads or signal pads of choice together allow for higher pin counts and higher density burn-in solutions.
  • Increase number of sites per socket and sockets per board
  • Account for SMT components on the top/bottom of board
  • Tether GND and I/Os together for higher pin counts
  • Custom footprints for most efficient use of space

Custom Devices – Custom Designs

  • Monitor, control, and regulate DUT temperature per test site
  • Improved airflow with channels in socket base and lid
  • Openings in socket base and lid for forced air or DUT access
  • Additional contacts to GND pad on some IC packages
  • Single and multi-site loading of devices maximize real estate
  • Electrical contacts to top and bottom of DUT during test
  • Relief cutouts in socket base provide component clearance
  • Replaceable inserts align packages with large tolerances

Design & Concept Gallery

REQUEST MORE INFO

MORE SOCKET SOLUTIONS

Bare Die & IC Test Sockets

For BGA, QFN, WLCSP, PGA, QFP, TSSOP and other packaged device types.  Compatible with a variety of RTI’s socket lids based on your test application.

READ MORE

PCB Module Test Sockets

For small PCB sub-assemblies and multi-chip modules. Providing precise DUT alignment with relief cutouts for SMT components and more.

READ MORE

Cartridge Carriers & Test Sockets

For small and fragile wafer-level devices that are prone to handling issues between test platforms.  Multi-site and single-site test socket configurations.

READ MORE

Universal Array Test Sockets

For groups of BGA devices that share a common pitch but different physical dimensions. A device specific alignment plate justifies A1 to upper left corner.

READ MORE

Customization Options

Test sockets can be modified in a variety of ways to accommodate unconventional devices. Discover what design options are available to meet your specific test requirements.

READ MORE

Socket Lids

Lids provide compression force between the DUT and electrical contact.  Each lid style includes design features important to your test application.

READ MORE

QUALITY GUARANTEE

Robson Technologies, Inc. interconnects, fixtures and systems are carefully designed, manufactured, inspected, and individually tested prior to shipment. In the unlikely case you find a defect in materials or workmanship, we will promptly repair or replace the component.

CONTACT US

Do you need help finding a test solution? Get in touch with an RTI Engineer!

GET IN TOUCH

OFFICE LINE

1.408.779.8008

OFFICE HOURS

8:00am – 5:00pm PST

OFFICE LINE

OFFICE HOURS

8:00am – 5:00pm PST