BURN-IN TEST SOLUTIONS

Robust machined test sockets that can perform in extreme temperatures and humidity to qualify any packaged IC, bare die, or custom module device.

BURN-IN SOCKET DESIGN

Highly Accelerated Stress Test (HAST) is a common reliability test process that goes above and beyond the traditional Temperature/Humidity/Bias (THB) burn-in test process.  HAST testing can yield results in 1/10th of the time but also requires faster ramp up and cool down times in higher temperature, pressure, and humidity ranges.  Not every test socket is suitable for this type of testing. 

Not Your Average Burn-In Test Socket

Our test sockets are built with high-performance materials and electrical contacts capable of meeting THB, HAST test requirements to ensure reliable and accurate results. Every complete burn-in socket and board solution is developed specifically for the device or module under test and verified in-house before shipment so they are ready to go; out of the box and into the oven.

RTI offers validation testing of all completed Burn-in board installations at the individual socket level and overall board level. Using custom manufactured shorting blocks that match the footprint of the DUT, RTI can quickly perform continuity tests of each signal in every socket. Benchtop signal verification testing is performed on boards with passive components such as resistors, diodes, and capacitors. Each burn-in board is tested at the edge connector to ensure board functionality at the system level.

Burn-in and test sockets for custom packages can incorporate a variety of design options that make them useful in and out of the oven. From floating bases to open-top lids, multiple test sites to varying device sizes, the inclusion of thermocouples, airflow channels, and more. RTI’s burn-in test solutions are biased HAST (b-HAST) and HTOL compatible. Typical temperature ranges are -55° to 150°C. We have designs outside of that range. Please contact us to discuss your test requirements and request a free quote.

RTI’s cartridge carriers and sockets are also used for burn-in applications.

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    Maximum Volume – Maximum Flexibility

    • Relief cutouts in test socket bases provide clearance for surface mount components placed close to each test site.
    • Tethering GND pads or signal pads of choice together allow for higher pin counts and higher density burn-in solutions.
    • Increase number of sites per socket and sockets per board
    • Custom footprints for most efficient use of space

    Custom Devices – Custom Designs

    • Monitor, control, and regulate DUT temperature per test site
    • Improved airflow with channels in socket base and lid
    • Openings in socket base and lid for forced air or DUT access
    • Additional contacts to GND pad on some IC packages
    • Single and multi-site loading of devices maximize real estate
    • Electrical contacts to top and bottom of DUT during test
    • Relief cutouts in socket base provide component clearance
    • Replaceable inserts align packages with large tolerances

    Maximum Volume – Maximum Flexibility

    • Relief cutouts in test socket bases provide clearance for surface mount components placed close to each test site.
    • Tethering GND pads or signal pads of choice together allow for higher pin counts and higher density burn-in solutions.
    • Increase number of sites per socket and sockets per board
    • Account for SMT components on the top/bottom of board
    • Tether GND and I/Os together for higher pin counts
    • Custom footprints for most efficient use of space

    Custom Devices – Custom Designs

    • Monitor, control, and regulate DUT temperature per test site
    • Improved airflow with channels in socket base and lid
    • Openings in socket base and lid for forced air or DUT access
    • Additional contacts to GND pad on some IC packages
    • Single and multi-site loading of devices maximize real estate
    • Electrical contacts to top and bottom of DUT during test
    • Relief cutouts in socket base provide component clearance
    • Replaceable inserts align packages with large tolerances

    Design & Concept Gallery

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    MORE SOCKET SOLUTIONS

    Bare Die & IC Test Sockets

    For BGA, QFN, WLCSP, PGA, QFP, TSSOP and other packaged device types.  Compatible with a variety of RTI’s socket lids based on your test application.

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    PCB Module Test Sockets

    For small PCB sub-assemblies and multi-chip modules. Providing precise DUT alignment with relief cutouts for SMT components and more.

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    PGA LGA image sensor socket

    Image Sensor Test Sockets

    For large-scale CMOS image sensors in ceramic packages to small cameras mounted to flex PCB’s.

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    Cartridge Carriers & Test Sockets

    For small and fragile wafer-level devices that are prone to handling issues between test platforms.  Multi-site and single-site test socket configurations.

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    Flat Top Socket Convertible for use with packaged devices, WLCSP

    FTSC Sockets

    Flat-top socket convertible sockets are a dedicated solution designed for the carrier/coupon boards with the pogo pin array specified to the packaged device.

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    Universal Array Test Sockets

    For groups of BGA devices that share a common pitch but different physical dimensions. A device specific alignment plate justifies A1 to upper left corner.

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    QUALITY GUARANTEE

    Robson Technologies, Inc. interconnects, fixtures and systems are carefully designed, manufactured, inspected, and individually tested prior to shipment. In the unlikely case you find a defect in materials or workmanship, we will promptly repair or replace the component.

    CONTACT US

    Do you need help finding a test solution? Get in touch with an RTI Engineer!

    GET IN TOUCH

    OFFICE LINE

    1.408.779.8008

    OFFICE HOURS

    8:00am – 5:00pm PST

    OFFICE LINE

    OFFICE HOURS

    8:00am – 5:00pm PST