BURN-IN TEST SOLUTIONS
Robust machined test sockets that can perform in extreme temperatures and humidity to qualify any packaged IC, bare die, or custom module device.
BURN-IN SOCKET DESIGN
Highly Accelerated Stress Test (HAST) is a common reliability test process that goes above and beyond the traditional Temperature/Humidity/Bias (THB) burn-in test process. HAST testing can yield results in 1/10th of the time but also requires faster ramp up and cool down times in higher temperature, pressure, and humidity ranges. Not every test socket is suitable for this type of testing.
Custom Burn-In Sockets
Compact single-site and multi-site test sockets conserve space on the burn-in board. Designed for bare die and other IC packaged devices with a variety of value-added design options.
Burn-In Boards
Designed for both custom and common burn-in ovens and HAST chambers alike. High-density boards can include header pins, surface mount components, and layout options to meet your needs.
High-Performance Materials
Reach high temperatures with short ramp-up times and maintain continuous performance with test sockets that use pogo pins with stainless steel springs and resilient body materials.
Not Your Average Burn-In Test Socket
Our test sockets are built with high-performance materials and electrical contacts capable of meeting THB, HAST test requirements to ensure reliable and accurate results. Every complete burn-in socket and board solution is developed specifically for the device or module under test and verified in-house before shipment so they are ready to go; out of the box and into the oven.
RTI offers validation testing of all completed Burn-in board installations at the individual socket level and overall board level. Using custom manufactured shorting blocks that match the footprint of the DUT, RTI can quickly perform continuity tests of each signal in every socket. Benchtop signal verification testing is performed on boards with passive components such as resistors, diodes, and capacitors. Each burn-in board is tested at the edge connector to ensure board functionality at the system level.
Burn-in and test sockets for custom packages can incorporate a variety of design options that make them useful in and out of the oven. From floating bases to open-top lids, multiple test sites to varying device sizes, the inclusion of thermocouples, airflow channels, and more. RTI’s burn-in test solutions are biased HAST (b-HAST) and HTOL compatible. Typical temperature ranges are -55° to 150°C. We have designs outside of that range. Please contact us to discuss your test requirements and request a free quote.
RTI’s cartridge carriers and sockets are also used for burn-in applications.
More Resources
Contact an Engineer
Maximum Volume – Maximum Flexibility
- Relief cutouts in test socket bases provide clearance for surface mount components placed close to each test site.
- Tethering GND pads or signal pads of choice together allow for higher pin counts and higher density burn-in solutions.
- Increase number of sites per socket and sockets per board
- Custom footprints for most efficient use of space
Custom Devices – Custom Designs
- Monitor, control, and regulate DUT temperature per test site
- Improved airflow with channels in socket base and lid
- Openings in socket base and lid for forced air or DUT access
- Additional contacts to GND pad on some IC packages
- Single and multi-site loading of devices maximize real estate
- Electrical contacts to top and bottom of DUT during test
- Relief cutouts in socket base provide component clearance
- Replaceable inserts align packages with large tolerances
Maximum Volume – Maximum Flexibility
- Relief cutouts in test socket bases provide clearance for surface mount components placed close to each test site.
- Tethering GND pads or signal pads of choice together allow for higher pin counts and higher density burn-in solutions.
- Increase number of sites per socket and sockets per board
- Account for SMT components on the top/bottom of board
- Tether GND and I/Os together for higher pin counts
- Custom footprints for most efficient use of space
Custom Devices – Custom Designs
- Monitor, control, and regulate DUT temperature per test site
- Improved airflow with channels in socket base and lid
- Openings in socket base and lid for forced air or DUT access
- Additional contacts to GND pad on some IC packages
- Single and multi-site loading of devices maximize real estate
- Electrical contacts to top and bottom of DUT during test
- Relief cutouts in socket base provide component clearance
- Replaceable inserts align packages with large tolerances
Design & Concept Gallery
MORE SOCKET SOLUTIONS
QUALITY GUARANTEE
Robson Technologies, Inc. interconnects, fixtures and systems are carefully designed, manufactured, inspected, and individually tested prior to shipment. In the unlikely case you find a defect in materials or workmanship, we will promptly repair or replace the component.
CONTACT US
Do you need help finding a test solution? Get in touch with an RTI Engineer!