CMOS & Image Sensors
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Click to EnlargePGA Socket with Heatsink
Click to EnlargePGA Socket with Open Bottom and Gimballed Lid
Click to EnlargeTest Socket for CMOS Image Sensors
Click to EnlargePGA Socket with Gimball Lid
Click to EnlargePGA Socket with Clamshell lid
Click to EnlargePGA Socket with Gimballed Lid and heatsink
Click to EnlargeGimballed Lid
Image Sensor Test Sockets – Because Visibility Matters
RTI image sensor test sockets are designed and manufactured to offer the greatest optical access in a wide variety of test applications including; failure analysis, dark-box sensor calibration, device qualification, programming, integration into larger sub-assembly test, and more. Sockets are designed to accommodate devices from small scale image sensor mounted to rigid-flex PCBs to large stand-alone ceramic-based CMOS camera modules used in high-resolution professional cameras.
PGA & LGA CMOS Camera Module Test Sockets
RTI’s pin-grid-array (PGA, pictured above left) and land-grid-array (LGA, pictured above right) test sockets allow for very short working distances during optical inspection of ceramic CMOS and CCD based camera modules. Wide openings in the lid provide optical and physical access to the image sensor during topside test and the low-profile yields a wide viewing angle.
Optional “open bottom” cutouts in the socket body and DUT board allow access to the bottom side of the package during test, often useful when for mounting thermal management components. Open bottom can also be useful for some Failure analysis fault localization methods
Copper (Cu), nickel-plated copper (NiCu) and Aluminum (Al) metal blocks can be incorporated into the socket body or lid for added thermal management. These spring-loaded “floating” heater blocks make direct contact with the ceramic package thermal pad and provide passive cooling to heat-intensive CMOS packages. They can also be combined with a temperature controller and thermocouple to actively heat or maintain a temperature range during test or with TEC or water block thermal heads for more cooling power.
X/Y pivoting “gimballed” lids (pictured above, open) reduce sheer force between the clamshell lid and DUT as the lid is closed and compression force is made. Minimal overlap is made between the perimeter of the opening in the gimballed lid and the DUT lead frame to provide a full view of the exposed sensor during test and wide viewing angle. This lid type is ideal for large footprint high-performance sensors and PGA based devices where fragile pin contacts are used.