In the ever-evolving world of semiconductor testing, Robson Technologies, Inc. (RTI) has been at the forefront of providing innovative solutions for over three decades. As the demand for faster, more efficient, and reliable testing methods continues to grow, RTI offers a range of solutions designed to meet the unique needs of the industry. Two key innovations are RTI’s Multi-Site test sockets and Cartridge Carriers, each with its own set of advantages and applications.
In this blog post, we will explore the differences and benefits of Multi-Site Sockets and Cartridge Carriers, shedding light on how their fundamentally similar yet unique designs contribute to improved efficiency across the semiconductor testing landscape.
Multi-Site Sockets: Enhancing Throughput and Efficiency

Multi-Site Sockets are designed to optimize semiconductor testing efficiency. They achieve this by testing multiple semiconductor devices at once in a single socket body, which is useful for burn-in and mid-volume hand testing of packaged ICs (Integrated Circuits) and modules.
Here’s what makes Multi-Site Sockets stand out:
Cartridge Carriers: Versatile Solutions for Advanced Applications

Cartridge Carriers also offer multi-site parallel testing of devices but aren’t built like traditional multi-site test sockets. They are designed to eliminate the process of loading and unloading individual devices from the test socket between test cycles. The cartridge carriers provide improved device management in semiconductor testing and are a versatile solution when used with different sockets across a variety of test methods. They are particularly useful for testing batches of small or fragile WLCSP and sensor devices that are prone to damage or loss typically experienced during the device loading process.
Let’s delve into their unique advantages:
Choosing the Right Solution
The choice between Multi-Site Sockets and Cartridge Carriers ultimately depends on the characteristics of the DUT and the comprehensive test programs employed by the testing facility.
Here are some factors to consider:
Multi-Site Sockets | Cartridge Carriers | |
---|---|---|
Device Types | Any type of packaged IC, discrete component, and some modules. DUTs usually >3mm in size. | Ideal for sub-2mm WLCSP, MEMS, and bumped die devices that are easily lost or damaged when handled. |
Socket Loading | Devices are individually loaded and removed from each site in the test socket between test cycles and across tester platforms. | Devices are pre-loaded into a multi-site carrier that is then mounted and removed from the test socket between test cycles and across tester platforms. |
Socket Mounting | The DUT board must seat and route signals from every site on the multi-site test socket, regardless if only one site is being tested. | The DUT board can also mount and route signals from a single site test socket which aligns to and contacts each individual test site on the multi-site cartridge carrier. |
Device Handling | Devices are handled every time the socket is loaded and unloaded between test cycles. | Devices are only handled when loading or unloading the cartridge carrier, not between each test cycle. |
Compression | A clip-on or screw-down lid applies downward force directly on each DUT, pushing the DUT against the | The top plate of the cartridge carrier assembly provides resistance when the cartridge is mounted to the pogo pin test socket. Spring pins in the test socket provide force, carrier lid provides resistance. |
Electrical Contacts | Spring pins, elastomers, and similar. | Spring pins only. |
Socket Footprints | Test sockets with fully customizable footprints and test site positioning for each DUT board. | Test sockets for every test board must be made compatible with the cartridge footprint first. |
Number of Sites | The contact footprint at each test site on the socket must match the DUT footprint. Each test site can be drilled for a unique footprint. | Contact footprint at each site on the socket can be a universal array. Positioning of drill holes on the cartridge must match the DUT footprint and mask unused pins. |
Conclusion
RTI offers a comprehensive suite of solutions to address the diverse needs of semiconductor testing facilities. Whether you require increased throughput and cost efficiency through Multi-Site Sockets or the improved device management across various test platforms provided by Cartridge Carriers, our innovative products are designed to optimize your testing processes and keep your long-term semiconductor testing operations working at peak efficiency.
By carefully considering your testing requirements and weighing the benefits of each solution, you can make an informed decision that suits your business objectives and operational needs.
To further discuss your needs, please contact us.