We Design Image Sensor Sockets to Your Needs
RTI offers a comprehensive range of test solutions for CCD and CMOS image sensors with leaded packages. Our sockets are custom configurations built for virtually any application from digital cameras to self-driving cars, security systems, and satellite imaging.
Test Applications We Design for:
- Failure analysis
- Light-box/dark-box sensor calibration
- Device qualification
- Integration into larger sub-assembly tests
- Pick & Place
- Optical side vs ball side
- Illumination array, and more
Thermal Management Options for Passive Cooling or Active Heat
Optional “open bottom” cutouts in the socket body and DUT board allow access to the bottom side of the package during test. This is often useful for mounting thermal management components. Open bottom sockets can also be useful for failure analysis fault localization methods.
Copper (Cu), nickel-plated copper (NiCu), and Aluminum (Al) metal blocks can be incorporated into the socket body or lid for added thermal management. These spring-loaded “floating” heater blocks make direct contact with the ceramic package thermal pad and provide passive cooling to heat-intensive CMOS packages. They can also be combined with a temperature controller and thermocouple to actively heat or maintain a temperature range during test or with TEC or water block thermal heads for more cooling power.
Gimballed Lids for High-Performance Optical Sensors
Open-Top Gimballed lid on a PGA Socket
RTI’s gimballed lid is a single hinge, single clip clamshell with a gimballed pressure plate. The gimballed design eliminates pinching when the test socket closes and ensures even pressure along the edges of the DUT while allowing a wide and low-profile, open top for a full view of the device with no contact to the glass window.
This lid configuration is ideal for high-performance optical sensors used in Space/Satellite hardware and professional cameras. The in-line spring pin design is similar to BGA test sockets and prevents any damage to the lead finish because the spring pin contacts the tip of the PGA pin rather than the side surfaces.
Gimballed Lid Features:
- Gimballed pressure plate ensures even pressure on package & eliminates pinching
- Wide, low profile, open-top for a full view of package/DUT
- Spring pin design prevents damage to package/DUT
- Ideal for high-performance, high-volume optical sensors
We are not limited in designing test solutions for custom devices. Please contact us to discuss your project or start your design.