From large scale CMOS image sensors in ceramic packages to small cameras mounted to flex PCB’s, RTI’s custom image sensor sockets protect valuable sensors from damage during tests and board assembly while providing 100% visibility of the sensor.


RTI image sensor sockets are designed and manufactured to offer the greatest optical access in a wide variety of test applications including failure analysis, dark-box sensor calibration, device qualification, final test, and more. Our sockets are designed to accommodate devices from small scale image sensor mounted onto flex/rigid-flex PCBs to large stand-alone ceramic-based CMOS camera modules used in high-resolution professional cameras.

We Design Image Sensor Sockets to Your Needs

RTI offers a comprehensive range of test solutions for CCD and CMOS image sensors with leaded packages. Our sockets are custom configurations built for virtually any application from digital cameras to self-driving cars, security systems, and satellite imaging.

Test Applications We Design for:

  • Failure analysis
  • Light-box/dark-box sensor calibration
  • Device qualification
  • Integration into larger sub-assembly tests
  • Pick & Place
  • Optical side vs ball side
  • Illumination array, and more

Thermal Management Options for Passive Cooling or Active Heat

Optional “open bottom” cutouts in the socket body and DUT board allow access to the bottom side of the package during test. This is often useful for mounting thermal management components. Open bottom sockets can also be useful for failure analysis fault localization methods.

Copper (Cu), nickel-plated copper (NiCu), and Aluminum (Al) metal blocks can be incorporated into the socket body or lid for added thermal management. These spring-loaded “floating” heater blocks make direct contact with the ceramic package thermal pad and provide passive cooling to heat-intensive CMOS packages. They can also be combined with a temperature controller and thermocouple to actively heat or maintain a temperature range during test or with TEC or water block thermal heads for more cooling power.

Gimballed Lids for High-Performance Optical Sensors

Gimballed lid for image sensor sockets

Open-Top Gimballed lid on a PGA Socket

RTI’s gimballed lid is a single hinge, single clip clamshell with a gimballed pressure plate. The gimballed design eliminates pinching when the test socket closes and ensures even pressure along the edges of the DUT while allowing a wide and low-profile, open top for a full view of the device with no contact to the glass window.

This lid configuration is ideal for high-performance optical sensors used in Space/Satellite hardware and professional cameras. The in-line spring pin design is similar to BGA test sockets and prevents any damage to the lead finish because the spring pin contacts the tip of the PGA pin rather than the side surfaces.

Gimballed Lid Features:

  • Gimballed pressure plate ensures even pressure on package & eliminates pinching
  • Wide, low profile, open-top for a full view of package/DUT
  • Spring pin design prevents damage to package/DUT
  • Ideal for high-performance, high-volume optical sensors

We are not limited in designing test solutions for custom devices. Please contact us to discuss your project or start your design.

More Resources

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    Bare Die & IC Test Sockets

    For BGA, QFN, WLCSP, PGA, QFP, TSSOP and other packaged device types.  Compatible with a variety of RTI’s socket lids based on your test application.

    PCB Module Test Sockets

    For small PCB sub-assemblies and multi-chip modules. Providing precise DUT alignment with relief cutouts for SMT components and more.

    PGA LGA image sensor socket

    Image Sensor Test Sockets

    For large-scale CMOS image sensors in ceramic packages to small cameras mounted to flex PCB’s.

    Cartridge Carriers & Test Sockets

    For small and fragile wafer-level devices that are prone to handling issues between test platforms.  Multi-site and single-site test socket configurations.

    Flat Top Socket Convertible for use with packaged devices, WLCSP

    FTSC Sockets

    Flat-top socket convertible sockets are a dedicated solution designed for the carrier/coupon boards with the pogo pin array specified to the packaged device.

    Universal Array Test Sockets

    For groups of BGA devices that share a common pitch but different physical dimensions. A device specific alignment plate justifies A1 to upper left corner.


    Robson Technologies, Inc. interconnects, fixtures and systems are carefully designed, manufactured, inspected, and individually tested prior to shipment. In the unlikely case you find a defect in materials or workmanship, we will promptly repair or replace the component.


    Do you need help finding a test solution? Get in touch with an RTI Engineer!



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    8:00am – 5:00pm PT