CUSTOM SOCKET DESIGN

Push the limits of what you can expect with a custom socket design. Our custom test sockets and lids are designed and built from the ground up to accomplish what off-the-shelf sockets can’t.

CUSTOM DESIGN OPTIONS

Custom sockets offer the most flexibility to design, material, interface types, and accessibility to your DUT/UUT. The example below shows a variety of design options that can be applied to most socket orders. Discuss what design options are available for your next project with an RTI engineer today.

(A) Incorporated spring hinged and single-clip clamshell lid design for ease of use and rapid product swapping.

(B) Small footprint test socket bodies for densely populated DUT boards or maximized number of test sites per burn-in board

(C) Pogo pins or Silmat contacts for very fine pitch, extreme temperature range, and high speed low inductance testing

(D) Relief cutouts in bottom side of socket base allow clearance for on-board components placed near test points

(E) Openings in socket base for backside probing/optical access to DUT, forced air cooling, or the inclusion of heatsinks

(F) Copper or plastic floating z-axis pressure plate distributes compression force evenly across the DUT

(G) Openings in lid for topside probing/optical access to DUT, forced air cooling, or heatsink installation

(H) Channels in test socket body, lids, and optional inserts for improved airflow or inclusion of a thermocouple

(I) Replaceable inserts for precise alignment of IC devices with wide dimensional tolerances to pogo pins or silmat contacts

(J) Compression mount design for ease of removal/reuse on multiple DUT boards and ease of service

Custom Socket Designs Built to Your Needs

We build custom socket designs for complex UUTs (units under test) and custom DUTs (device under test). Our custom sockets are ideal for applications where socket design and test requirements are not met by standard off-the-shelf solutions. This includes, but is not limited to burn-in, failure analysis, high current, high performance, temperature testing, RF characterization, and more.

We build high-performance and reliable sockets designed to your DUT or UUT and test applications. We have various design options from custom footprints to low-profile, contacts on any side of your device to interfaces with auto-handlers, open socket bases to open lids, and more.

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Mounting Footprint

  • Designed for compatibility with your existing DUT boards 
  • Alignment and mounting features match your DUT board or ATE auto-handler load board  
  • Clearances and keep out areas both in the socket body and area surrounding the test socket 
  • Compression and through hole mounting available 
  • Pitch translation interposers integrated into the socket or lid to meet specific pinouts 
  • Custom sized test sockets for use with forced air thermal head or where physical space is limited 

Contact Methods

  • Numerous contact styles available including pogo pin, elastomer, receptacle,  and high-speed connectors 
  • Contact all faces of your DUT, including the sides with horizontally loaded pogo pins 
  • Multiple pin types can be used in the same test socket  
  • High force contacts for lead-free packages 
  • High Speed / low inductance for 5G and IoT applications 
  • Multi-site test sockets accept multiple packages with the same or different footprints 

Test Requirements

  • Temperature control at the device level using built in Ni and Cu heatsinks and heater blocks 
  • Physical and optical access to specific areas of your DUT 
  • Kelvin contacts, coaxial contacts, and low-inductance contacts for RF characterization & test 
  • Topside device access to the backside of a package 
  • Very high temperature, high current, and high humidity materials available 
  • Low force contacts for fragile devices 

Mounting Footprint

  • Designed for compatibility with your existing DUT boards 
  • Alignment and mounting features match your DUT board or ATE auto-handler load board  
  • Clearances and keep out areas both in the socket body and area surrounding the test socket 
  • Compression and through hole mounting available 
  • Pitch translation interposers integrated into the socket or lid to meet specific pinouts 
  • Custom sized test sockets for use with forced air thermal head or where physical space is limited 

Contact Methods

  • Numerous contact styles available including pogo pin, elastomer, receptacle,  and high-speed connectors 
  • Contact all faces of your DUT, including the sides with horizontally loaded pogo pins 
  • Multiple pin types can be used in the same test socket  
  • High force contacts for lead-free packages 
  • High Speed / low inductance for 5G and IoT applications 
  • Multi-site test sockets accept multiple packages with the same or different footprints 

Test Requirements

  • Temperature control at the device level using built in Ni and Cu heatsinks and heater blocks 
  • Physical and optical access to specific areas of your DUT 
  • Kelvin contacts, coaxial contacts, and low-inductance contacts for RF characterization & test 
  • Topside device access to the backside of a package 
  • Very high temperature, high current, and high humidity materials available 
  • Low force contacts for fragile devices 

Design & Concept Gallery

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MORE SOCKET SOLUTIONS

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PCB Module Test Sockets

For small PCB sub-assemblies and multi-chip modules. Providing precise DUT alignment with relief cutouts for SMT components and more.

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Cartridge Carriers & Test Sockets

For small and fragile wafer-level devices that are prone to handling issues between test platforms.  Multi-site and single-site test socket configurations.

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Universal Array Test Sockets

For groups of BGA devices that share a common pitch but different physical dimensions. A device specific alignment plate justifies A1 to upper left corner.

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Customization Options

Test sockets can be modified in a variety of ways to accommodate unconventional devices. Discover what design options are available to meet your specific test requirements.

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Socket Lids

Lids provide compression force between the DUT and electrical contact.  Each lid style includes design features important to your test application.

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QUALITY GUARANTEE

Robson Technologies, Inc. interconnects, fixtures and systems are carefully designed, manufactured, inspected, and individually tested prior to shipment. In the unlikely case you find a defect in materials or workmanship, we will promptly repair or replace the component.

CONTACT US

Do you need help finding a test solution? Get in touch with an RTI Engineer!

GET IN TOUCH

OFFICE LINE

1.408.779.8008

OFFICE HOURS

8:00am – 5:00pm PST

OFFICE LINE

OFFICE HOURS

8:00am – 5:00pm PST