CUSTOM TEST SOCKET DESIGN

Push the limits of what you can expect with a custom test socket design. Our custom test sockets and lids are designed and built from the ground up to accomplish what off-the-shelf sockets can’t.

CUSTOM TEST SOCKET DESIGN OPTIONS

Custom test sockets offer the most flexibility to design, material, interface types, and accessibility to your DUT/UUT. The example below shows a variety of design options that can be applied to most socket orders. Discuss what design options are available for your next project with an RTI engineer today.

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Topside Relief Cutouts

Machined pockets in the test socket provide clearance for SMD components installed on the bottom side of the DUT.

Backside Relief Cutouts

Machined cutouts on the PCB side of the socket body provide clearance for SMD components installed as close as 0.02 inches on the DUT board.

Temperature Monitoring

A built-in Resistance Temperature Detector (RTD) contacts the DUT and provides precise temperature monitoring down to 0.1°C.

Replaceable Inserts

High volume test can wear out the pocket that aligns the DUT to the pins. Replaceable inserts reduce cost, downtime, and extend socket life.

Kelvin Contacts

Test sense and force of each lead on the DUT using a pair of traditional fine pitch pogo pins or specialized Kelvin pins based on lead type.

Interstitial & Very Fine Pitch

Drilled and pinned for packages with multiple pitches and/or irregular load patterns. Very fine pitch (<0.3mm) for high-density packages.

RF & High Speed

Shielded and coaxial pogo pins reduce signal to noise ratio for high bandwidth applications. Short signal path for electrical transparency.

Elastomeric & SILMAT™

Short signal path contacts for high frequency (>40GHz) and low inductance (<0.02nH) digital testing. High force; leaves no witness marks.

High-Temp Ceramic

Ceramic or CeramaPEEK socket bodies and high-temp rated pogo pins allow for burn-in and HAST temperatures exceeding 250°C.

High Pin Counts

3,800+ pins and >3.0″ footprints using stainless steel frames and backing plates prevent socket and device from flexing when compression force is applied.

Space Saving Burn-In

Populate your burn-in boards with more sockets than ever using compact clamshell sockets as small as 0.9in.

Heatsinks

Floating or fixed height nickel-plated copper (NiCu) slugs make direct contact to DUT through a hole in the socket body and PCB.

Backside Access

Holes machined into the socket base and PCB provides physical and optical backside access to the DUT during probing, inspection, and test.

Multiple Test Sites

Economic sockets ideal for mid-volume hand test. Test multiple devices of the same or different footprints using the same test socket body.

Matched Mounting Footprints

Sockets with custom mounting positions for use with your existing DUT boards or on boards with limited space for a socket

CMOS Image Sensor

Complete visibility of sensor area via topside or backside access, even when devices have test points on the same side as the sensor.

CSP & Bare Die

100% edge-to-edge visibility of bare die chip scale packages using a quartz or sapphire glass swatch to apply compression force.

Built From Scratch: RTI’s Custom Test Sockets are Designed to Your Device and Environment

We build custom test socket designs for complex UUTs (units under test) and custom DUTs (device under test). Our custom sockets are ideal for applications where socket design and test requirements are not met by standard off-the-shelf solutions. This includes, but is not limited to burn-in, failure analysis, high current, high performance, temperature testing, RF characterization, and more.

We build high-performance and reliable sockets designed for your DUT or UUT and test applications. Custom pogo pins, stamped gold contacts, Silmat(TM), and elastomeric contact sets may be developed for specialized applications. We have various design options from custom footprints to low-profile, contacts on any side of your device to interfaces with auto-handlers, open socket bases to open lids, and more.

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Mounting Footprint

  • Designed for compatibility with your existing DUT boards
  • Alignment and mounting features match your DUT board or ATE auto-handler load board
  • Clearances and keep out areas both in the socket body and area surrounding the test socket
  • Compression and through hole mounting available
  • Pitch translation interposers integrated into the socket or lid to meet specific pinouts
  • Custom sized test sockets for use with a forced air thermal head or where physical space is limited

Contact Methods

  • Numerous contact styles available including pogo pin, elastomer, receptacle,  and high-speed connectors
  • Contact all faces of your DUT, including the sides with horizontally loaded pogo pins
  • Multiple pin types can be used in the same test socket
  • High force contacts for lead-free packages
  • High Speed / low inductance for 5G and IoT applications
  • Multi-site test sockets accept multiple packages with the same or different footprints

Test Requirements

  • Temperature control at the device level using built in Ni and Cu heatsinks and heater blocks
  • Physical and optical access to specific areas of your DUT
  • Kelvin contacts, coaxial contacts, and low-inductance contacts for RF characterization & test
  • Topside device access to the backside of a package
  • Very high temperature, high current, and high humidity materials available
  • Low force contacts for fragile devices
Request a Free Quote Today!

Check Out RTI’s Custom Test Socket Designs

More Resources

Contact an Engineer

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    Various coatings are available for metallic based socket bodies
    High pincount elastomer socket with cantilever lid for even pressure
    Stamped and formed one piece pins contact edges of DUT
    Custom rigid-flex clamshell style socket with access to lens
    Custom ZIF sockets for high pincount PGA and CMOS image sensors
    Custom socket with horizontally loaded pogo pins contact DUT edges
    Custom heated pedistal with two stage lid closing system
    Custom heated pedistal with two stage lid closing system
    Custom socket with horizontally loaded pogo pins contact DUT edges
    Custom ZIF sockets for high pincount PGA and CMOS image sensors
    Custom rigid-flex clamshell style socket with access to lens
    Stamped and formed one piece pins contact edges of DUT
    High pincount elastomer socket with cantilever lid for even pressure
    Various coatings are available for metallic based socket bodies
    Custom dual stage clamshell socket for flex PCB DUT includes pneumatics
    Deadbug loaded socket with topside access through contacts in lid
    Custom footprint test socket fits the diameter of a penny
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    REQUEST MORE INFO

    Engineering Design

    Custom devices require custom solutions. We apply best practice design principals in mechanical engineering and PCB layout, recognizing that a custom device under test requires an equally custom test interface solution.

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    Our Approach

    Learn. Design. Create. Support.

    We work directly with your team every step of the way, from prototype through production, to ensure your test solution meets or exceeds expectations.  Reduce your overall cost of test with design options that are useful across multiple test applications.

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    In-House Manufacturing

    Complete control of the manufacturing process ensures that parts are machined within tight tolerances and ensures complete compatibility with other sub-assemblies incorporated in the final build.

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    MORE SOCKET SOLUTIONS

    Bare Die & IC Test Sockets

    For BGA, QFN, WLCSP, PGA, QFP, TSSOP and other packaged device types.  Compatible with a variety of RTI’s socket lids based on your test application.

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    PCB Module Test Sockets

    For small PCB sub-assemblies and multi-chip modules. Providing precise DUT alignment with relief cutouts for SMT components and more.

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    PGA LGA image sensor socket

    Image Sensor Test Sockets

    For large-scale CMOS image sensors in ceramic packages to small cameras mounted to flex PCB’s.

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    Cartridge Carriers & Test Sockets

    For small and fragile wafer-level devices that are prone to handling issues between test platforms.  Multi-site and single-site test socket configurations.

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    Flat Top Socket Convertible for use with packaged devices, WLCSP

    FTSC Sockets

    Flat-top socket convertible sockets are a dedicated solution designed for the carrier/coupon boards with the pogo pin array specified to the packaged device.

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    Universal Array Test Sockets

    For groups of BGA devices that share a common pitch but different physical dimensions. A device specific alignment plate justifies A1 to upper left corner.

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    QUALITY GUARANTEE

    Robson Technologies, Inc. interconnects, fixtures and systems are carefully designed, manufactured, inspected, and individually tested prior to shipment. In the unlikely case you find a defect in materials or workmanship, we will promptly repair or replace the component.

    CONTACT US

    Do you need help finding a test solution? Get in touch with an RTI Engineer!

    GET IN TOUCH

    OFFICE LINE

    1.408.779.8008

    EMAIL

    rtisales@testfixtures.com

    OFFICE HOURS

    8:00am – 5:00pm PT

    OFFICE LINE

    1.408.779.8008

    EMAIL

    rtisales@testfixtures.com

    OFFICE HOURS

    8:00am – 5:00pm PT