CUSTOM SOCKET DESIGN
Push the limits of what you can expect with a custom socket design. Our custom test sockets and lids are designed and built from the ground up to accomplish what off-the-shelf sockets can’t.
CUSTOM DESIGN OPTIONS
Custom sockets offer the most flexibility to design, material, interface types, and accessibility to your DUT/UUT. The example below shows a variety of design options that can be applied to most socket orders. Discuss what design options are available for your next project with an RTI engineer today.
Topside Relief Cutouts
Machined pockets in the test socket provide clearance for SMD components installed on the bottom side of the DUT.
Backside Relief Cutouts
Machined cutouts on the PCB side of the socket body provide clearance for SMD components installed as close as 0.02 inches on the DUT board.
Temperature Monitoring
A built-in Resistance Temperature Detector (RTD) contacts the DUT and provides precise temperature monitoring down to 0.1°C.
Replaceable Inserts
High volume test can wear out the pocket that aligns the DUT to the pins. Replaceable inserts reduce cost, downtime, and extend socket life.
Kelvin Contacts
Test sense and force of each lead on the DUT using a pair of traditional fine pitch pogo pins or specialized Kelvin pins based on lead type.
Interstitial & Very Fine Pitch
Drilled and pinned for packages with multiple pitches and/or irregular load patterns. Very fine pitch (<0.3mm) for high-density packages.
RF & High Speed
Elastomeric & SILMAT™
High-Temp Ceramic
High Pin Counts
Zero Insertion Force (ZIF)
Mechanically improved alternative to injection molded plastic ZIF sockets. Mates with a receptacle or soldered directly to the DUT board.
Space Saving Burn-In
Populate your burn-in boards with more sockets than ever using compact clamshell sockets as small as 0.9in.
Heatsinks
Floating or fixed height nickel-plated copper (NiCu) slugs make direct contact to DUT through a hole in the socket body and PCB.
Backside Access
Holes machined into the socket base and PCB provides physical and optical backside access to the DUT during probing, inspection, and test.
Multiple Test Sites
Economic sockets ideal for mid-volume hand test. Test multiple devices of the same or different footprints using the same test socket body.
Matched Mounting Footprints
Sockets with custom mounting positions for use with your existing DUT boards or on boards with limited space for a socket
CMOS Image Sensor
Complete visibility of sensor area via topside or backside access, even when devices have test points on the same side as the sensor.
CSP & Bare Die
100% edge-to-edge visibility of bare die chip scale packages using a quartz or sapphire glass swatch to apply compression force.
Custom Socket Designs Built to Your Needs
We build custom socket designs for complex UUTs (units under test) and custom DUTs (device under test). Our custom sockets are ideal for applications where socket design and test requirements are not met by standard off-the-shelf solutions. This includes, but is not limited to burn-in, failure analysis, high current, high performance, temperature testing, RF characterization, and more.
We build high-performance and reliable sockets designed for your DUT or UUT and test applications. Custom pogo pins, stamped gold contacts, Silmat(TM), and elastomeric contact sets may be developed for specialized applications. We have various design options from custom footprints to low-profile, contacts on any side of your device to interfaces with auto-handlers, open socket bases to open lids, and more.
Mounting Footprint
- Designed for compatibility with your existing DUT boards
- Alignment and mounting features match your DUT board or ATE auto-handler load board
- Clearances and keep out areas both in the socket body and area surrounding the test socket
- Compression and through hole mounting available
- Pitch translation interposers integrated into the socket or lid to meet specific pinouts
- Custom sized test sockets for use with a forced air thermal head or where physical space is limited
Contact Methods
- Numerous contact styles available including pogo pin, elastomer, receptacle, and high-speed connectors
- Contact all faces of your DUT, including the sides with horizontally loaded pogo pins
- Multiple pin types can be used in the same test socket
- High force contacts for lead-free packages
- High Speed / low inductance for 5G and IoT applications
- Multi-site test sockets accept multiple packages with the same or different footprints
Test Requirements
- Temperature control at the device level using built in Ni and Cu heatsinks and heater blocks
- Physical and optical access to specific areas of your DUT
- Kelvin contacts, coaxial contacts, and low-inductance contacts for RF characterization & test
- Topside device access to the backside of a package
- Very high temperature, high current, and high humidity materials available
- Low force contacts for fragile devices
Mounting Footprint
- Designed for compatibility with your existing DUT boards
- Alignment and mounting features match your DUT board or ATE auto-handler load board
- Clearances and keep out areas both in the socket body and area surrounding the test socket
- Compression and through hole mounting available
- Pitch translation interposers integrated into the socket or lid to meet specific pinouts
- Custom sized test sockets for use with a forced air thermal head or where physical space is limited
Contact Methods
- Numerous contact styles available including pogo pin, elastomer, receptacle, and high-speed connectors
- Contact all faces of your DUT, including the sides with horizontally loaded pogo pins
- Multiple pin types can be used in the same test socket
- High force contacts for lead-free packages
- High Speed / low inductance for 5G and IoT applications
- Multi-site test sockets accept multiple packages with the same or different footprints
Test Requirements
- Temperature control at the device level using built in Ni and Cu heatsinks and heater blocks
- Physical and optical access to specific areas of your DUT
- Kelvin contacts, coaxial contacts, and low-inductance contacts for RF characterization & test
- Topside device access to the backside of a package
- Very high temperature, high current, and high humidity materials available
- Low force contacts for fragile devices
Design & Concept Gallery
MORE SOCKET SOLUTIONS
QUALITY GUARANTEE
Robson Technologies, Inc. interconnects, fixtures and systems are carefully designed, manufactured, inspected, and individually tested prior to shipment. In the unlikely case you find a defect in materials or workmanship, we will promptly repair or replace the component.
CONTACT US
Do you need help finding a test solution? Get in touch with an RTI Engineer!