RTI designs custom high pin count test sockets for failure analysis and power testing of AI, telecommunications, datacom devices, multimedia processors, and other CPU intensive end-use applications.
High pin count test sockets are a dedicated solution featuring precision manufacturing and precise ball alignment to maintain test point accuracy.
What is unusual about this BGA socket is the non-floating base. Typical high pin count BGA sockets use a floating base due to the contact force applied to plastic material. This socket features a 3-piece design in stainless steel to withstand the contact force in a non-floating base. Learn more about floating and non-floating bases here.