IC TEST SOCKETS

Our IC & WLCSP test sockets are for all package types including singulated die level devices. RTI compression mount test sockets give you the performance you require with an unmatched level of design customization.

SOCKET DESIGN

Work directly with our engineers to develop a test socket solution that is 100% compatible with your DUT and test requirements. Our socket and lid designs are machined to order.

Targeted Socket Solutions

We design and manufacture IC and WLCSP test sockets to meet your specific physical, electrical, and environmental test requirements. Our capabilities range from packaged IC devices to leadless packages to castellated contacts and varying pin pitches to high-pin count devices.

We can incorporate a variety of design options from floating bases to open-top lids, multiple test sites to varying device sizes, thermal tests to stimulation tests, and more.

Non-Floating Base Architecture

non floating base for test sockets
Ideal for QFN, LGA, and other packages without leads or solder balls. Non-floating base test sockets are essentially a two-piece pogo pin block with a pocket to align and seat the DUT during test. Since there are no additional floating plate or spring components built into the socket body, non-floating base test sockets can utilize pogo pins and elastomeric (SILMAT) contact sets with shorter electrical lengths than their floating base counterparts. This makes non-floating base architecture sockets more suitable for RF and high-speed test applications.

Floating Base Architecture

floating base for test sockets

While most pogo pin test sockets make direct contact between the DUT and pins when loaded, floating base test sockets separate the DUT pocket from the rest of the socket body. The “floating” DUT pocket rests on springs contained in the socket body and sits higher than the DUT side tips of the pogo pins. Floating base test sockets allow a small amount of Z-axis travel of both the DUT and the floating pocket independent of the socket body as a compression force is made.

Contact an Engineer

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    Devices and Packages We Design for:

    • CSP, WLCSPbare-die 
    • Flip-Chip, BGA, PGA 
    • QFN, LGA, LCC Devices 
    • QFP, TSSOP, lead frame 
    • SOIC, SO, PQF, Flat Pack 
    • And more 

    Socket Design Options:

    • Replaceable Alignment Features 
    • Interstitial and custom pinouts 
    • Matching Footprints 
    • Multiple test sites 
    • Integrated heatsinks 
    • Topside & Backside access 
    • Relief Cutouts for components 

    Test Applications:

    • ATE / Hand Test 
    • Inspection / Failure analysis  
    • Prototyping / Engineering 
    • Production / Pick and Place 
    • Burn-In / HAST 
    • Characterization 
    • Device programming 

    Devices and Packages We Design for:

    • CSP, WLCSPbare-die 
    • Flip-Chip, BGA, PGA 
    • QFN, LGA, LCC Devices 
    • QFP, TSSOP, lead-frame 
    • SOIC, SO, Flat Pack 
    • And more 

    Socket Design Options:

    • Replaceable Alignment Features 
    • Interstitial and custom pinouts 
    • Matching Footprints 
    • Multiple test sites 
    • Integrated heatsinks 
    • Topside & Backside access 
    • Relief Cutouts for components 

    Test Applications:

    • ATE / Hand Test 
    • Inspection / Failure analysis  
    • Prototyping / Engineering 
    • Production / Pick and Place 
    • Burn-In / HAST 
    • Characterization 
    • Device programming 

    Design & Concept Gallery

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    MORE SOCKET SOLUTIONS

    Bare Die & IC Test Sockets

    For BGA, QFN, WLCSP, PGA, QFP, TSSOP and other packaged device types.  Compatible with a variety of RTI’s socket lids based on your test application.

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    PCB Module Test Sockets

    For small PCB sub-assemblies and multi-chip modules. Providing precise DUT alignment with relief cutouts for SMT components and more.

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    PGA LGA image sensor socket

    Image Sensor Test Sockets

    For large-scale CMOS image sensors in ceramic packages to small cameras mounted to flex PCB’s.

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    Cartridge Carriers & Test Sockets

    For small and fragile wafer-level devices that are prone to handling issues between test platforms.  Multi-site and single-site test socket configurations.

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    Flat Top Socket Convertible for use with packaged devices, WLCSP

    FTSC Sockets

    Flat-top socket convertible sockets are a dedicated solution designed for the carrier/coupon boards with the pogo pin array specified to the packaged device.

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    Universal Array Test Sockets

    For groups of BGA devices that share a common pitch but different physical dimensions. A device specific alignment plate justifies A1 to upper left corner.

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    QUALITY GUARANTEE

    Robson Technologies, Inc. interconnects, fixtures and systems are carefully designed, manufactured, inspected, and individually tested prior to shipment. In the unlikely case you find a defect in materials or workmanship, we will promptly repair or replace the component.

    CONTACT US

    Do you need help finding a test solution? Get in touch with an RTI Engineer!

    GET IN TOUCH

    OFFICE LINE

    1.408.779.8008

    OFFICE HOURS

    8:00am – 5:00pm PST

    OFFICE LINE

    OFFICE HOURS

    8:00am – 5:00pm PST