Designed to Specification
We design and manufacture WLCSP and IC test sockets to meet your specific physical, electrical, and environmental test requirements. Our capabilities range from packaged IC devices to leadless packages to castellated contacts and varying pin pitches to high-pin count devices.
We can incorporate a variety of design options from floating bases to open-top lids, multiple test sites to varying device sizes, thermal tests to stimulation tests, and more.
Non-Floating Base Architecture
Ideal for QFN, LGA, and other packages without leads or solder balls, non-floating base and test sockets are essentially a two-piece pogo pin block with a pocket to align and seat a DUT during test. Since there are no additional floating plate or spring components built into the socket body, non-floating base test sockets can utilize pogo pins and elastomeric (SILMAT) contact sets with shorter electrical lengths than their floating base counterparts. This makes non-floating base architecture sockets more suitable for RF and high-speed test applications.
Floating Base Architecture
While most pogo pin test sockets make direct contact between the DUT and pins when loaded, floating base test sockets separate the DUT pocket from the rest of the socket body. The “floating” DUT pocket rests on springs contained in the socket body and sits higher than the DUT side tips of the pogo pins. Floating base test sockets allow a small amount of Z-axis travel of both the DUT and the floating pocket independent of the socket body as a compression force is made.