IC TEST SOCKETS
Our IC & WLCSP test sockets are for all package types including singulated die level devices. RTI compression mount test sockets give you the performance you require with an unmatched level of design customization.
Targeted Socket Solutions
We design and manufacture IC and WLCSP test sockets to meet your specific physical, electrical, and environmental test requirements. Our capabilities range from packaged IC devices to leadless packages to castellated contacts and varying pin pitches to high-pin count devices.
We can incorporate a variety of design options from floating bases to open-top lids, multiple test sites to varying device sizes, thermal tests to stimulation tests, and more.
Non-Floating Base Architecture

Floating Base Architecture

While most pogo pin test sockets make direct contact between the DUT and pins when loaded, floating base test sockets separate the DUT pocket from the rest of the socket body. The “floating” DUT pocket rests on springs contained in the socket body and sits higher than the DUT side tips of the pogo pins. Floating base test sockets allow a small amount of Z-axis travel of both the DUT and the floating pocket independent of the socket body as a compression force is made.
More details on the floating and non-floating socket bases are here.
More Resources
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Devices and Packages We Design for:
- CSP, WLCSP, bare-die
- Flip-Chip, BGA, PGA
- QFN, LGA, LCC Devices
- QFP, TSSOP, lead frame
- SOIC, SO, PQF, Flat Pack
- And more

Socket Design Options:
- Replaceable Alignment Features
- Interstitial and custom pinouts
- Matching Footprints
- Multiple test sites
- Integrated heatsinks
- Topside & Backside access
- Relief Cutouts for components

Test Applications:
- ATE / Hand Test
- Inspection / Failure analysis
- Prototyping / Engineering
- Production / Pick and Place
- Burn-In / HAST
- Characterization
- Device programming

Devices and Packages We Design for:
- CSP, WLCSP, bare-die
- Flip-Chip, BGA, PGA
- QFN, LGA, LCC Devices
- QFP, TSSOP, lead-frame
- SOIC, SO, Flat Pack
- And more

Socket Design Options:
- Replaceable Alignment Features
- Interstitial and custom pinouts
- Matching Footprints
- Multiple test sites
- Integrated heatsinks
- Topside & Backside access
- Relief Cutouts for components

Test Applications:
- ATE / Hand Test
- Inspection / Failure analysis
- Prototyping / Engineering
- Production / Pick and Place
- Burn-In / HAST
- Characterization
- Device programming
Design & Concept Gallery
MORE SOCKET SOLUTIONS

QUALITY GUARANTEE
Robson Technologies, Inc. interconnects, fixtures and systems are carefully designed, manufactured, inspected, and individually tested prior to shipment. In the unlikely case you find a defect in materials or workmanship, we will promptly repair or replace the component.
CONTACT US
Do you need help finding a test solution? Get in touch with an RTI Engineer!