BARE DIE & IC TEST SOCKETS

Our bare die & IC test sockets are for all package types including singulated die level devices. RTI compression mount test sockets give you the performance you require with an unmatched level of design customization.

BARE DIE & IC SOCKET DESIGN

Work directly with our engineers to develop a test socket solution that is 100% compatible with your DUT and test requirements. Our socket and lid designs are machined to order.

Designed to Specification

We design and manufacture bare die and IC test sockets to meet your specific physical, electrical, and environmental test requirements. Our capabilities range from packaged IC devices to bare die, leadless packages to castellated contacts, and varying pin pitches to high-pin count devices.

We can incorporate a variety of design options from floating bases to open-top lids, multiple test sites to varying device sizes, thermal tests to stimulation tests, and more.

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Devices and Packages We Design for:

  • CSP, WLCSPbare-die 
  • Flip-Chip, BGA, PGA 
  • QFN, LGA, LCC Devices 
  • QFP, TSSOP, lead frame 
  • SOIC, SO, PQF, Flat Pack 
  • And more 

Socket Design Options:

  • Replaceable Alignment Features 
  • Interstitial and custom pinouts 
  • Matching Footprints 
  • Multiple test sites 
  • Integrated heatsinks 
  • Topside & Backside access 
  • Relief Cutouts for components 

Test Applications:

  • ATE / Hand Test 
  • Inspection / Failure analysis  
  • Prototyping / Engineering 
  • Production / Pick and Place 
  • Burn-In / HAST 
  • Characterization 
  • Device programming 

Devices and Packages We Design for:

  • CSP, WLCSPbare-die 
  • Flip-Chip, BGA, PGA 
  • QFN, LGA, LCC Devices 
  • QFP, TSSOP, lead-frame 
  • SOIC, SO, Flat Pack 
  • And more 

Socket Design Options:

  • Replaceable Alignment Features 
  • Interstitial and custom pinouts 
  • Matching Footprints 
  • Multiple test sites 
  • Integrated heatsinks 
  • Topside & Backside access 
  • Relief Cutouts for components 

Test Applications:

  • ATE / Hand Test 
  • Inspection / Failure analysis  
  • Prototyping / Engineering 
  • Production / Pick and Place 
  • Burn-In / HAST 
  • Characterization 
  • Device programming 

Design & Concept Gallery

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MORE SOCKET SOLUTIONS

Bare Die & IC Test Sockets

For BGA, QFN, WLCSP, PGA, QFP, TSSOP and other packaged device types.  Compatible with a variety of RTI’s socket lids based on your test application.

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PCB Module Test Sockets

For small PCB sub-assemblies and multi-chip modules. Providing precise DUT alignment with relief cutouts for SMT components and more.

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Cartridge Carriers & Test Sockets

For small and fragile wafer-level devices that are prone to handling issues between test platforms.  Multi-site and single-site test socket configurations.

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Universal Array Test Sockets

For groups of BGA devices that share a common pitch but different physical dimensions. A device specific alignment plate justifies A1 to upper left corner.

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Customization Options

Test sockets can be modified in a variety of ways to accommodate unconventional devices. Discover what design options are available to meet your specific test requirements.

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Socket Lids

Lids provide compression force between the DUT and electrical contact.  Each lid style includes design features important to your test application.

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QUALITY GUARANTEE

Robson Technologies, Inc. interconnects, fixtures and systems are carefully designed, manufactured, inspected, and individually tested prior to shipment. In the unlikely case you find a defect in materials or workmanship, we will promptly repair or replace the component.

CONTACT US

Do you need help finding a test solution? Get in touch with an RTI Engineer!

GET IN TOUCH

OFFICE LINE

1.408.779.8008

OFFICE HOURS

8:00am – 5:00pm PST

OFFICE LINE

OFFICE HOURS

8:00am – 5:00pm PST