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Low Profile, Open Top

RTI's anodized aluminum or steel lids are ideal for failure analysis, EMMI, and micro-probing techniques. These lids offer physical and optical access to the topside of the DUT. They make contact to the perimeter of the package lead frame on the DUT or PCB module with as little as 0.02in overlap on each side.  The minimal overall thickness of these lids makes them great when you need to get close to the topside of your device during inspection. Closed lids are also available. 
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