PCB Module Test Sockets for Complex Devices

Engineered sockets for multi-chip modules and flexible PCB layouts.
RTI designs PCB module test sockets that replace bulky press fixtures when validating complex electronic assemblies. Each socket is engineered to support SMT components, stacked modules, and flexible boards while providing simultaneous contact to top and bottom test points. With precise alignment, stable signal integrity, and long-term reliability, our solutions streamline development and production testing for wireless, display, and microcontroller modules.
PCB Module Test Sockets for Complex Devices
Engineered sockets for multi-chip modules and flexible PCB layouts.
RTI designs PCB module test sockets that replace bulky press fixtures when validating complex electronic assemblies. Each socket is engineered to support SMT components, stacked modules, and flexible boards while providing simultaneous contact to top and bottom test points. With precise alignment, stable signal integrity, and long-term reliability, our solutions streamline development and production testing for wireless, display, and microcontroller modules.

Alternatives to Test Presses
RTI’s PCB module test sockets are typically used for functional or in-circuit testing of PCB-based module devices during product development and characterization—before ramping up to panelized or final test. Depending on the UUT’s on-board components, test points, and alignment features, PCB module sockets may be the better choice for your lab. They take up less bench space, offer a lower-cost approach, and can often be delivered faster than larger format test fixtures.
PCB module sockets also provide closer working areas than scaled-up press fixtures. Large openings in the lid expose surface-mount components such as sensors, antennas, and high-speed connectors, allowing you to position probes and tools within millimeters of the UUT surface.
Custom Component Clearances


For small, critical SMT components near test points, we machine precise pockets to eliminate pressure or obstruction during loading. Socket bases and lids are engineered to apply compression force and provide backplane support only where required, while avoiding sensitive components. These cutouts not only ensure the UUT rests flat, they can also improve airflow or allow access to specific areas during test.
Dual Sided Probing


Interposer lids integrate short-length pogo pins and mini-PCBs that make direct contact with test points on the top side of the UUT. Within the lid, the embedded PCB routes signals from the UUT to contacts that re-engage with the socket body. Multiple interconnect configurations are available for routing signals between the lid and the test board.
For applications requiring access to both sides of the device, we use a precise alignment method that relies on non-plated holes in the UUT. Keyed dowel pins in the lid act as guides, ensuring that everything lines up with the socket body and remains securely in place during test.
Castellated Contact Options

Devices with castellated edge contacts can be probed using multiple methods depending on pad geometry. If gold-plated pads surround the castellation, pointed-tip spring pins can be used for direct contact. If pads are absent, pins with a larger tip diameter than the cutout can both align the UUT and provide a reliable electrical connection during test.
To identify the best alignment and contact strategy for your device, submit top and bottom layer STEP or GERBER files of your module to RTI for evaluation.
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