PCB MODULE TEST SOCKETS

PCB module sockets are ideal for testing small PCB sub-assemblies and multi-chip modules. Intelligent test socket and lid design ensure device compatibility without sacrificing performance or device level access.

PCB MODULE SOCKET DESIGN

Custom engineered with fine alignment features and intelligent design options that offer the most for device access and electrical performance. Our robust PCB module test sockets have a variety of customized layouts optimized for use across multiple test applications. Non-plated thru-holes on the UUT are used for fine alignment of the device to the pogo pins.  Dowel pins in the socket base align with the non-plated thru-holes on the device and are essential for testing devices with small test pads, fine pitch, wide dimensional tolerances, or test points on the top and bottom of the device.  Additional alignment techniques are available. 

PCB Module Sockets Designed to Your Needs

Our capabilities range from RF modules to medical devices, camera modules to sensor modules, optical devices to sub-assemblies, Rigid-Flex assemblies and more.  

We incorporate various design options from castellated contacts to compression mounting, multi-site to contacts on 2 levels, alignment features to fitting various sizes of your PCB module. Fully enclosed RF shielding can completely encompass the test socket for TX/RX signal integrity testing.  

Custom lids can be designed to ensure device-level access, topside electrical contacts, and/or provide unobstructed support for special device features such as SMT components.  Lids can also include high speed connectors to contact test points on the top of the UUT, clearances for antennas, heatsinks to contact tin lids or logical components 

We are not limited in designing test solutions for custom devices. Please contact us to discuss your project or start your design. 

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Castellated Contacts

  • Pointed tip pogo pins can contact the rectangular landing pad around the castellation. 
  • If pads are not available around the castellation, pins with pin tip diameter larger than the cutout are used. 
  • Castellations on UUT can provide rough alignment of device to pogo pins. 
  • Submit STEP or GERBER files of your UUT PCB to an RTI engineer to review available options 

Component Clearances

  • Entire portions of the socket base can be cut away to provide access to the backside of the UUT  
  • Small pockets are milled out to offer clearance for surface mount components placed very close to test points. 
  • Relief cutouts can be incorporated into lids to avoid pressure sensitive areas on lidded devices or cut away completely for topside access 

Probe Both Sides of Your Module

  • Interposer type lids include pogo pins that contact test points located on the topside of your UUT  
  • A small PCB in the lid routes signals out to an array of contacts that mate with T-pins in the test socket body 
  • Non plated thru hole alignment is required for dual side contact sockets.  Dowel pins in the lids provide keying and fine alignment to the socket body when closed 

Castellated Contacts

  • Pointed tip pogo pins can contact the rectangular landing pad around the castellation. 
  • If pads are not available around the castellation, pins with pin tip diameter larger than the cutout are used. 
  • Castellations on UUT can provide rough alignment of device to pogo pins. 
  • Submit STEP or GERBER files of your UUT PCB to an RTI engineer to review available options 

Component Clearances

  • Entire portions of the socket base can be cut away to provide access to the backside of the UUT  
  • Small pockets are milled out to offer clearance for surface mount components placed very close to test points. 
  • Relief cutouts can be incorporated into lids to avoid pressure sensitive areas on lidded devices or cut away completely for topside access 

Hit Test Points on Both Sides of Your Module

  • Interposer type lids include pogo pins that contact test points located on the topside of your UUT  
  • A small PCB in the lid routes signals out to an array of contacts that mate with T-pins in the test socket body 
  • Non plated thru hole alignment is required for dual side contact sockets.  Dowel pins in the lids provide keying and fine alignment to the socket body when closed 

Design & Concept Gallery

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MORE SOCKET SOLUTIONS

Bare Die & IC Test Sockets

For BGA, QFN, WLCSP, PGA, QFP, TSSOP and other packaged device types.  Compatible with a variety of RTI’s socket lids based on your test application.

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PCB Module Test Sockets

For small PCB sub-assemblies and multi-chip modules. Providing precise DUT alignment with relief cutouts for SMT components and more.

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Cartridge Carriers & Test Sockets

For small and fragile wafer-level devices that are prone to handling issues between test platforms.  Multi-site and single-site test socket configurations.

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Universal Array Test Sockets

For groups of BGA devices that share a common pitch but different physical dimensions. A device specific alignment plate justifies A1 to upper left corner.

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Customization Options

Test sockets can be modified in a variety of ways to accommodate unconventional devices. Discover what design options are available to meet your specific test requirements.

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Socket Lids

Lids provide compression force between the DUT and electrical contact.  Each lid style includes design features important to your test application.

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QUALITY GUARANTEE

Robson Technologies, Inc. interconnects, fixtures and systems are carefully designed, manufactured, inspected, and individually tested prior to shipment. In the unlikely case you find a defect in materials or workmanship, we will promptly repair or replace the component.

CONTACT US

Do you need help finding a test solution? Get in touch with an RTI Engineer!

GET IN TOUCH

OFFICE LINE

1.408.779.8008

OFFICE HOURS

8:00am – 5:00pm PST

OFFICE LINE

OFFICE HOURS

8:00am – 5:00pm PST