SOCKETS LIDS

Complete your test socket solution with a dynamic lid designed to suit your test configuration. Many lid types can be used with the same test socket body allowing the socket to be used across multiple test applications.

LID DESIGN

Custom lids offer the most flexibility to design, material, interface types and accessibility to your DUT/UUT.  

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Design Socket Lids to Your Needs

Lids provide the compression force required to make electrical contact between the DUT and electrical contact set (I.e. Pogo pins, Elastomer, etc.) Our test socket lids are tailored to your device and test applications with adjustable z-axis pressure platesvery low-profiles, open-tops, dual latches for quick swap or integrated clamshell designs. Our socket lids are dynamic, and one of our test sockets can accept multiple lid designs. Simply change the lid style and watch as your socket changes from a failure analysis socket to a low-volume engineering or production test socket. 

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Device Level Access

  • Very low-profile open-top lids offer visibility to decapsulated parts 
  • Only millimeters thick, open-top lids let you get closer to your device when used under a scope 
  • Quartz and Sapphire glass windows apply compression force to WLCSP and bare die devices requiring 100% DUT visibility 
  • Made with anodized aluminum or stainless steel depending on size and pin count of DUT 
  • Custom machined openings in the lid for access to specific areas over larger DUTs 

Integrated Thermal Control

  • Built-in Ni or Cu blocks make direct contact with the DUT 
  • Thermocouples contact the DUT for device level temperature monitoring 
  • Mates with an RTI benchtop temperature controller for active heating 
  • Incorporated fans for passive air cooling 
  • Openings at specific areas in the lid for forced air cooling applications 
  • Openings in the sides of the lid for additional airflow 
  • Floating pressure plates ensure contact sets are not over compressed 

Built-In Contacts

  • Pogo pins can be installed to contact test points on the topside of a UUT 
  • Interposer PCB’s installed within the lid route signals out to pads that contact pins in the socket body 
  • RF sensitive materials available for UUT’s with antennas 
  • High speed coaxial connectors and other surface mount connectors installed on a PCB incorporated into the lid 
  • Custom wiring available in the lid 

Device Level Access

  • Very low-profile open-top lids offer visibility to decapsulated parts 
  • Only millimeters thick, open-top lids let you get closer to your device when used under a scope 
  • Quartz and Sapphire glass windows apply compression force to WLCSP and bare die devices requiring 100% DUT visibility 
  • Made with anodized aluminum or stainless steel depending on size and pin count of DUT 
  • Custom machined openings in the lid for access to specific areas over larger DUTs 

Integrated Thermal Control

  • Built-in Ni or Cu blocks make direct contact with the DUT 
  • Thermocouples contact the DUT for device level temperature monitoring 
  • Mates with an RTI benchtop temperature controller for active heating 
  • Incorporated fans for passive air cooling 
  • Openings at specific areas in the lid for forced air cooling applications 
  • Openings in the sides of the lid for additional airflow 
  • Floating pressure plates ensure contact sets are not over compressed 

Built-In Contacts

  • Pogo pins can be installed to contact test points on the topside of a UUT 
  • Interposer PCB’s installed within the lid route signals out to pads that contact pins in the socket body 
  • RF sensitive materials available for UUT’s with antennas 
  • High speed coaxial connectors and other surface mount connectors installed on a PCB incorporated into the lid 
  • Custom wiring available in the lid 

Design & Concept Gallery

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MORE SOCKET SOLUTIONS

Bare Die & IC Test Sockets

For BGA, QFN, WLCSP, PGA, QFP, TSSOP and other packaged device types.  Compatible with a variety of RTI’s socket lids based on your test application.

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PCB Module Test Sockets

For small PCB sub-assemblies and multi-chip modules. Providing precise DUT alignment with relief cutouts for SMT components and more.

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Cartridge Carriers & Test Sockets

For small and fragile wafer-level devices that are prone to handling issues between test platforms.  Multi-site and single-site test socket configurations.

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Universal Array Test Sockets

For groups of BGA devices that share a common pitch but different physical dimensions. A device specific alignment plate justifies A1 to upper left corner.

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Customization Options

Test sockets can be modified in a variety of ways to accommodate unconventional devices. Discover what design options are available to meet your specific test requirements.

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Socket Lids

Lids provide compression force between the DUT and electrical contact.  Each lid style includes design features important to your test application.

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QUALITY GUARANTEE

Robson Technologies, Inc. interconnects, fixtures and systems are carefully designed, manufactured, inspected, and individually tested prior to shipment. In the unlikely case you find a defect in materials or workmanship, we will promptly repair or replace the component.

CONTACT US

Do you need help finding a test solution? Get in touch with an RTI Engineer!

GET IN TOUCH

OFFICE LINE

1.408.779.8008

OFFICE HOURS

8:00am – 5:00pm PST

OFFICE LINE

OFFICE HOURS

8:00am – 5:00pm PST