SOCKETS LIDS

Complete your test socket solution with a dynamic lid designed to suit your test configuration. Many lid types can be used with the same test socket body allowing the socket to be used across multiple test applications.

LID DESIGN

Custom lids offer the most flexibility to design, material, interface types and accessibility to your DUT/UUT.  

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Design Socket Lids to Your Needs

Lids provide the compression force required to make electrical contact between the DUT and electrical contact set (I.e. Pogo pins, Elastomer, etc.) Our test socket lids are tailored to your device and test applications with adjustable z-axis pressure platesvery low-profiles, open-tops, dual latches for quick swap, or integrated clamshell designs. Our socket lids are dynamic, and one of our test sockets can accept multiple lid designs. Simply change the lid style and watch as your socket changes from a failure analysis socket to a low-volume engineering or production test socket. 

IC Socket with Screw Down Lids

Maximize access to the DUT during Test 

Using Very Low Profile, Open Top, Screw-Down lids

  • Widest angle of approach for maximum exposure to sensors 
  • As little as 1mm thickness above the surface of the package 
  • For longer test processes such as imaging, probing, or calibrating   
  • Quartz or sapphire window lids for edge-to-edge exposure of WLCSP surface 
  • Anodized Aluminum or Stainless Steel for a thin but rigid design 

IC Socket with Clip on Socket Lids

Cycle through DUTs faster during Hand Test 

With a Single or Dual-Latch, Clip-On Lid

  • Reduce downtime spent loading and unloading DUTs 
  • Spring-loaded pressure plate from plastic or copper acts as a heatsink 
  • Small opening above DUT for additional airflow and prevent DUT sticking 
  • Fully removable, or attached to a hinged bracket that screws onto socket base  
  • Some socket models can incorporate a single latch clamshell lid 

IC Socket with Adjustable Height Socket Lids

Apply more vertical force with less operator effort 

Hand tightened lids with evenly distributed compression

  • Lubricated, high thread count adjustable z-axis pressure plate 
  • Large knob and optional detachable handles for ease of use 
  • Precision machined to prevent over-compression  
  • Stainless steel parts prevent bowing or flexing  
  • Incorporate fans, fins, and openings for additional thermal dissipation 

Custom Socket Lids for Sockets

Custom lid designs for technical projects 

Innovative options to satisfy demanding test requirements 

  • Thermal lids for air/water cooling 
  • Incorporated RTD or thermocouple 
  • Make electrical contact to the DUT routed through PCB in the lid 
  • Incorporate coaxial connectors for RF devices 
  • Relief cutouts for clearance of components on DUT 
  • Apply compression force at only specific points on the DUT     
  • And more! 

Contact an Engineer

    Device Level Access

    • Very low-profile open-top lids offer visibility to decapsulated parts 
    • Only millimeters thick, open-top lids let you get closer to your device when used under a scope 
    • Quartz and Sapphire glass windows apply compression force to WLCSP and bare die devices requiring 100% DUT visibility 
    • Made with anodized aluminum or stainless steel depending on size and pin count of DUT 
    • Custom machined openings in the lid for access to specific areas over larger DUTs 

    Integrated Thermal Control

    • Built-in Ni or Cu blocks make direct contact with the DUT 
    • Thermocouples contact the DUT for device level temperature monitoring 
    • Mates with an RTI benchtop temperature controller for active heating 
    • Incorporated fans for passive air cooling 
    • Openings at specific areas in the lid for forced air cooling applications 
    • Openings in the sides of the lid for additional airflow 
    • Floating pressure plates ensure contact sets are not over compressed 

    Built-In Contacts

    • Pogo pins can be installed to contact test points on the topside of a UUT 
    • Interposer PCB’s installed within the lid route signals out to pads that contact pins in the socket body 
    • RF sensitive materials available for UUT’s with antennas 
    • High speed coaxial connectors and other surface mount connectors installed on a PCB incorporated into the lid 
    • Custom wiring available in the lid 

    Device Level Access

    • Very low-profile open-top lids offer visibility to decapsulated parts 
    • Only millimeters thick, open-top lids let you get closer to your device when used under a scope 
    • Quartz and Sapphire glass windows apply compression force to WLCSP and bare die devices requiring 100% DUT visibility 
    • Made with anodized aluminum or stainless steel depending on size and pin count of DUT 
    • Custom machined openings in the lid for access to specific areas over larger DUTs 

    Integrated Thermal Control

    • Built-in Ni or Cu blocks make direct contact with the DUT 
    • Thermocouples contact the DUT for device level temperature monitoring 
    • Mates with an RTI benchtop temperature controller for active heating 
    • Incorporated fans for passive air cooling 
    • Openings at specific areas in the lid for forced air cooling applications 
    • Openings in the sides of the lid for additional airflow 
    • Floating pressure plates ensure contact sets are not over compressed 

    Built-In Contacts

    • Pogo pins can be installed to contact test points on the topside of a UUT 
    • Interposer PCB’s installed within the lid route signals out to pads that contact pins in the socket body 
    • RF sensitive materials available for UUT’s with antennas 
    • High speed coaxial connectors and other surface mount connectors installed on a PCB incorporated into the lid 
    • Custom wiring available in the lid 

    Design & Concept Gallery

    REQUEST MORE INFO

    MORE SOCKET SOLUTIONS

    Bare Die & IC Test Sockets

    For BGA, QFN, WLCSP, PGA, QFP, TSSOP and other packaged device types.  Compatible with a variety of RTI’s socket lids based on your test application.

    READ MORE

    PCB Module Test Sockets

    For small PCB sub-assemblies and multi-chip modules. Providing precise DUT alignment with relief cutouts for SMT components and more.

    READ MORE
    PGA LGA image sensor socket

    Image Sensor Test Sockets

    For large-scale CMOS image sensors in ceramic packages to small cameras mounted to flex PCB’s.

    READ MORE

    Cartridge Carriers & Test Sockets

    For small and fragile wafer-level devices that are prone to handling issues between test platforms.  Multi-site and single-site test socket configurations.

    READ MORE
    Flat Top Socket Convertible for use with packaged devices, WLCSP

    FTSC Sockets

    Flat-top socket convertible sockets are a dedicated solution designed for the carrier/coupon boards with the pogo pin array specified to the packaged device.

    READ MORE

    Universal Array Test Sockets

    For groups of BGA devices that share a common pitch but different physical dimensions. A device specific alignment plate justifies A1 to upper left corner.

    READ MORE

    QUALITY GUARANTEE

    Robson Technologies, Inc. interconnects, fixtures and systems are carefully designed, manufactured, inspected, and individually tested prior to shipment. In the unlikely case you find a defect in materials or workmanship, we will promptly repair or replace the component.

    CONTACT US

    Do you need help finding a test solution? Get in touch with an RTI Engineer!

    GET IN TOUCH

    OFFICE LINE

    1.408.779.8008

    OFFICE HOURS

    8:00am – 5:00pm PST

    OFFICE LINE

    OFFICE HOURS

    8:00am – 5:00pm PST