SOCKETS LIDS
Complete your test socket solution with a dynamic lid designed to suit your test configuration. Many lid types can be used with the same test socket body allowing the socket to be used across multiple test applications.
LID DESIGN
Custom lids offer the most flexibility to design, material, interface types and accessibility to your DUT/UUT.
Adjustable Lids
A threaded knob controlling a variable z-axis pressure plate allows for fine adjustment to compression force on your device or package. Low-profile and open-top designs are available.
Screw-Down Lids
Typically used in failure analysis, for topside die access, or applications with restrictive keep-out areas surrounding the test socket. Our aluminum and stainless steel screw-down lids are low-profile with Quartz or Sapphire window options available.
Clip-On Lids
Typically used in hand ATE test and other engineering test applications where DUTs are constantly being swapped out., Dual latch clip-on lids can be removed from the socket or integrated into a clamshell design. Precisely aligns to your DUT with integration options such as floating pressure plate, heatsink, copper block, and more.
Custom Lids
Sometimes custom UUT designs or test configurations require the use of a customized lid. Fully customized lids address your test requirements with a variety of design option such as contacting test points on the topside of the UUT, integrated thermocouples and heating/cooling blocks, machined keep-out areas, attachment methods, and more
Design Socket Lids to Your Needs
Lids provide the compression force required to make electrical contact between the DUT and electrical contact set (I.e. Pogo pins, Elastomer, etc.) Our test socket lids are tailored to your device and test applications with adjustable z-axis pressure plates, very low-profiles, open-tops, dual– latches for quick swap, or integrated clamshell designs. Our socket lids are dynamic, and one of our test sockets can accept multiple lid designs. Simply change the lid style and watch as your socket changes from a failure analysis socket to a low-volume engineering or production test socket.
Maximize access to the DUT during Test
Using Very Low Profile, Open Top, Screw-Down lids
- Widest angle of approach for maximum exposure to sensors
- As little as 1mm thickness above the surface of the package
- For longer test processes such as imaging, probing, or calibrating
- Quartz or sapphire window lids for edge-to-edge exposure of WLCSP surface
- Anodized Aluminum or Stainless Steel for a thin but rigid design
Cycle through DUTs faster during Hand Test
With a Single or Dual-Latch, Clip-On Lid
- Reduce downtime spent loading and unloading DUTs
- Spring-loaded pressure plate from plastic or copper acts as a heatsink
- Small opening above DUT for additional airflow and prevent DUT sticking
- Fully removable, or attached to a hinged bracket that screws onto socket base
- Some socket models can incorporate a single latch clamshell lid
Apply true vertical force with fine adjustment to z-height
Hand tightened lids with evenly distributed compression
- Lubricated, high thread count adjustable z-axis pressure plate
- Large knob and optional detachable handles for ease of use
- Precision machined to prevent over-compression
- Stainless steel parts prevent bowing or flexing
- Incorporate fans, fins, and openings for additional thermal dissipation
Apply more compression force with less operator effort
Gain significant mechanical advantage with a simple design
- Ideal for high pin count, fine pitch, and high-density packages
- Crossbeam in lid base acts as a fulcrum for lid top when closed
- Gimballed pressure plate rests flat across DUT surface as compression force is made
- Single latch lid can be pressed closed and opened with a gentle push of a finger
- Additional heatsinks, openings, and customization options are available
Integrated PoP (Package on Package) Lids, or Interposer Lids
When the DUT includes topside test points
- Simultaneous contacts to topside & bottomside test points
- Topside pitches >0.4mm, Bottomside pitches >0.3mm
- Make electrical contact with the DUT routed through PCB in the lid
- Incorporate coaxial connectors for RF devices
- Clip-on removable and screw-down lid designs
Custom lid designs for technical projects
Innovative options to satisfy demanding test requirements
- Thermal lids for air/water cooling
- Incorporated RTD or thermocouple
- Relief cutouts for clearance of components on DUT
- Apply compression force at only specific points on the DUT
- And more!
More Resources
Contact an Engineer
Device Level Access
- Very low-profile open-top lids offer visibility to decapsulated parts
- Only millimeters thick, open-top lids let you get closer to your device when used under a scope
- Quartz and Sapphire glass windows apply compression force to WLCSP and bare die devices requiring 100% DUT visibility
- Made with anodized aluminum or stainless steel depending on size and pin count of DUT
- Custom machined openings in the lid for access to specific areas over larger DUTs
Integrated Thermal Control
- Built-in Ni or Cu blocks make direct contact with the DUT
- Thermocouples contact the DUT for device level temperature monitoring
- Mates with an RTI benchtop temperature controller for active heating
- Incorporated fans for passive air cooling
- Openings at specific areas in the lid for forced air cooling applications
- Openings in the sides of the lid for additional airflow
- Floating pressure plates ensure contact sets are not over compressed
Built-In Contacts
- Pogo pins can be installed to contact test points on the topside of a UUT
- Interposer PCB’s installed within the lid route signals out to pads that contact pins in the socket body
- RF sensitive materials available for UUT’s with antennas
- High speed coaxial connectors and other surface mount connectors installed on a PCB incorporated into the lid
- Custom wiring available in the lid
Device Level Access
- Very low-profile open-top lids offer visibility to decapsulated parts
- Only millimeters thick, open-top lids let you get closer to your device when used under a scope
- Quartz and Sapphire glass windows apply compression force to WLCSP and bare die devices requiring 100% DUT visibility
- Made with anodized aluminum or stainless steel depending on size and pin count of DUT
- Custom machined openings in the lid for access to specific areas over larger DUTs
Integrated Thermal Control
- Built-in Ni or Cu blocks make direct contact with the DUT
- Thermocouples contact the DUT for device level temperature monitoring
- Mates with an RTI benchtop temperature controller for active heating
- Incorporated fans for passive air cooling
- Openings at specific areas in the lid for forced air cooling applications
- Openings in the sides of the lid for additional airflow
- Floating pressure plates ensure contact sets are not over compressed
Built-In Contacts
- Pogo pins can be installed to contact test points on the topside of a UUT
- Interposer PCB’s installed within the lid route signals out to pads that contact pins in the socket body
- RF sensitive materials available for UUT’s with antennas
- High speed coaxial connectors and other surface mount connectors installed on a PCB incorporated into the lid
- Custom wiring available in the lid
Design & Concept Gallery
MORE SOCKET SOLUTIONS
QUALITY GUARANTEE
Robson Technologies, Inc. interconnects, fixtures and systems are carefully designed, manufactured, inspected, and individually tested prior to shipment. In the unlikely case you find a defect in materials or workmanship, we will promptly repair or replace the component.
CONTACT US
Do you need help finding a test solution? Get in touch with an RTI Engineer!
OFFICE LINE
1.408.779.8008
rtisales@testfixtures.com
OFFICE HOURS