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By Application

RTI makes a very wide selection of test sockets for any device that needs to be tested.  These solutions can be organized into application categories.  Depending on how the socket is to be used, different sets of concerns are applicable.  Many of these areas make a good case to use an engineered socket from RTI.
  • Failure Analysis: Interchangeable lids make RTI socket bases useful in a variety of F/A applications
    • Open top lids allow visual access for Optical Fault Localization purposes
    • Window lids allow open top access for WLCSP and CSP devices
    • Adjustable Open top F/A lids have slightly taller profile but offer adjustability to allow for devices that may have been thinned for analysis preparation.
    • Sockets are low profile to fit under a microscope. 
    • Open bottom features allow analysis on the same side as the contacts
    • Dead Bug Sockets allow some devices to be inserted bottom side up 
    • Socket heaters help bring the device into the failure zone or control background temperature for certain techniques like liquid crystal
    • Paired with an RTI PCB DUT board, can interface to a wide range of FA applicable test equipment
  • Curve Tracing: Curve tracing is a subset of Failure Analysis and usually happens at the beginning of an analysis to confirm certain failure signatures.  The device has usually not been opened yet so we pair the RTI socket base with a clip on lid with spring loaded pressure plate for faster socket operation.  
  • Device Characterization: Characterization requirements can vary as widely as the device being tested.  Whether you be characterizing AC performance and need a high bandwidth pin or testing temperature stability and need a high temperature socket, RTI can taylor the design to meet your specs, tell us what you need.
  • ESD Characterization: While some labs may save money using off the shelf sockets, the wide range of contact types in those sockets makes it hard to correlate results across different packages.  RTI sockets use short high bandwidth spring pins and multiple pins for ground paddles and we can do this for a range of different packages allowing for better statistical matching of results across package types for the same product.
  • Production testing: Production testing needs a socket that will last through many insertions and is either easy for the operator to load and unload or for a robotic handler to access.  
  • Burn in: BI applications are usually cost sensitive and high volume because sometimes hundreds of devices must be fixture simultaneously and connected the test system and placed in an oven.  In situations where you have a unique or new package not served by molded socket manufacturers or where an entire module is being burned in, RTI sockets can be a cost effective solution.  For small devices, RTI multi Siite sockets dramatically lower the cost per test site by ganging many devices into one socket.
  • Functional Debug or test: Functional rest requirements vary as much as the device being tested.  Some MEMS devices need ability to apply air pressure or vary position.  Other devices require high bandwidth while others need high current or need to be able to shed a lot of heat.  Whatever your requirement, RTI can design a socket based on your specs that will get the job done.

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