UNIVERSAL ARRAY TEST SOCKETS
#1 Cost-effective test socket solution when testing needs to be performed on multiple mid-high pin count packages within the same pitch. Reduce your cost of test by testing multiple high-pin count devices using the universal array test socket.
UNIVERSAL ARRAY SOCKET DESIGN
Designed for BGA, LGA, WLCSP, die level packages, and other arrayed IC packages that share a common pitch but differ in lead frame size. A device-agnostic socket base is produced for the maximum size array you require for devices with pitch down to 0.3mm. A device-specific alignment feature drops into the test socket nest and masks over the pin array leaving only the pins corresponding to the DUT footprint available. The alignment feature combined with the drilled holes in the floating base of the socket align and justify the DUT to the A1 corner of the pin array.
Universal Array Sockets
For groups of devices that share a common pitch but different physical dimensions. A device specific alignment plate justifies A1 to upper left corner.
Socket Lids
Clip-on, adjustable lids allow for rapid switching of packages. Open-top, screw-down lids are available for failure analysis tests.
Universal Array Test Sockets Designed to Your Needs
One universal array socket base with 2 different alignment plates for different sizes of device footprints.
Our universal array test sockets are available in a variety of footprints based on the size of your DUT. We use a pogo pin-based contact set manufactured to the largest anticipated array you require.
Devices of the same pitch but with fewer test pads are aligned to the A1 corner of the pin array using a device-specific alignment plate feature.
OEMs can take advantage of our universal test socket to test entire families of parts using a single socket rather than a device-specific test socket for each new package, ultimately reducing the cost-of-test.
We are not limited to designing test solutions for custom devices. Please contact us to discuss your project or start your design.
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Universal Socket Base
- A device-agnostic floating base test socket is drilled and pinned for maximum required array size.
- BGA devices can roughly align to the pin array as solder balls sit in the drilled holes
- Interstitial drilling patterns are available
- Test sockets are compression mount and can be removed from the board for service or replacement
- Universal socket bases use high-performance long lasting pogo pins
- Actual insertion life depends on test environment, regular cleaning of particle contaminants from pin tips, and recommended operation.
Device-Specific Alignment Features
- Machined aluminum or plastic inserts include pockets that are machined to size based on DxE dimensions of the DUT
- Milled pocket in the alignment plate justifies ball A1 on the DUT with the upper left most hole in the universal array
- Quick swap alignment plates act as masks, blocking off all pogo pin contacts except those required by the DUT
Universal and Device-Specific Lids
- Open-top and closed-top low-profile lids for failure analysis are DUT specific and attach directly to the test socket via screws
- Quartz and Sapphire glass window lids may be universal depending on whether each DUT shares the same thickness
- Testing devices with varying package thicknesses requires device-specific lids
- Clip-on adjustable lids are a universal replacement for hand-screwing low-profile lids to the sockets. Ideal for rapid swapping of DUTs
Universal Socket Base
- A device-agnostic floating base test socket is drilled and pinned for maximum required array size.
- BGA devices can roughly align to the pin array as solder balls sit in the drilled holes
- Interstitial drilling patterns are available
- Test sockets are compression mount and can be removed from the board for service or replacement
- Universal socket bases use high-performance long lasting pogo pins
- Actual insertion life depends on test environment, regular cleaning of particle contaminants from pin tips, and recommended operation.
Device-Specific Alignment Features
- Machined aluminum or plastic inserts include pockets that are machined to size based on DxE dimensions of the DUT
- Milled pocket in the alignment plate justifies ball A1 on the DUT with the upper left most hole in the universal array
- Quick swap alignment plates act as masks, blocking off all pogo pin contacts except those required by the DUT
Universal and Device-Specific Lids
- Open-top and closed-top low-profile lids for failure analysis are DUT specific and attach directly to the test socket via screws
- Quartz and Sapphire glass window lids may be universal depending on whether each DUT shares the same thickness
- Testing devices with varying package thicknesses requires device-specific lids
- Clip-on adjustable lids are a universal replacement for hand-screwing low-profile lids to the sockets. Ideal for rapid swapping of DUTs
Design & Concept Gallery
MORE SOCKET SOLUTIONS
QUALITY GUARANTEE
Robson Technologies, Inc. interconnects, fixtures and systems are carefully designed, manufactured, inspected, and individually tested prior to shipment. In the unlikely case you find a defect in materials or workmanship, we will promptly repair or replace the component.
CONTACT US
Do you need help finding a test solution? Get in touch with an RTI Engineer!