Universal Array Test Sockets
For BGA, LGA, and WLCSP packages with variable device footprints on a shared pitch.
RTI designs and manufactures universal array test sockets that support device families sharing the same pitch but with varying package sizes and pin counts. By using a single socket body with device-specific alignment plates, these solutions simplify inventory, reduce setup changes, and maintain reliable electrical performance. Whether for R&D, device validation, or production runs, our universal sockets ensure accurate alignment and consistent results.
Universal Array Test Sockets
For BGA, LGA, and WLCSP packages with variable device footprints on a shared pitch.
RTI designs and manufactures universal array test sockets that support device families sharing the same pitch but with varying package sizes and pin counts. By using a single socket body with device-specific alignment plates, these solutions simplify inventory, reduce setup changes, and maintain reliable electrical performance. Whether for R&D, device validation, or production runs, our universal sockets ensure accurate alignment and consistent results.
Universal Array Test Sockets Overview
RTI designs and manufactures universal array test sockets for BGA, LGA, and WLCSP device families that share a common pitch but vary in package size. Each socket is precision-drilled to your specified pitch, with options spanning 0.3 mm through 1.27+ mm, allowing multiple device sizes to be tested in the same socket hardware. This approach reduces cost of ownership, simplifies inventory, and ensures repeatable alignment and electrical reliability across different DUT footprints.
The Concept
(A) Universal Array Test Socket Body is drilled at your desired pitch for the largest array size you anticipate testing. This impacts the ultimate versatility of the socket, as multiple packages of smaller arrays with the same pitch can be tested using the same socket.
(B) Device Specific Alignment Plates are installed to mask over unused pins and align each package to the unchanging Pin A1 position in the upper left corner for easier pin mapping
(C) Screw Down Open/Closed Top or Sapphire Window Lids are designed for each new device that will be tested. Variations in package size and thickness between DUTs mean unique lids are needed for optimal compression.
(D) Optional Universal, Clip-on, Adjustable Lids specific to socket series may be available. These lids allow for more rapid swap-out of packages by removing the need to unscrew the FA lid with each insertion.
Universal Array Socket Base
Sockets drilled and pinned for the maximum array size can test devices of the same pitch but smaller footprint using interchangeable alignment plates. This design reduces the number of dedicated sockets required, while maintaining consistent pin mapping between the DUT and test equipment.
Typical package types supported: BGA, LGA, WLCSP
User can specify the desired A1 reference location when a new alignment plate is designed
Universal WLCSP Test Sockets Available Sizes
Universal BGA Test Sockets Available Sizes
Device-Specific Alignment Plates
Device-specific alignment plates are precision-engineered components used in IC testing to ensure accurate and repeatable positioning of the DUT within a test socket or fixture. These plates are tailored to the specific dimensions and features of a particular IC package, making them a critical element in high-precision testing environments.
Alignment plates justify the A1 ball of the DUT to the A1 pin position on the test socket to maintain pinout consistency across devices but can be customized to align to your desired position in the pin array.
Alignment Plates for WLCSP/CSP devices:
- Material: Ultem1000, Cirlex
- Mounting: Pressure Fit, Keyed
- Nominal Thickness: 0.3mm (variable based on DUT thickness)
Alignment Plates for packaged IC devices:
- Material: Aluminum, Ultem
- Mounting: 4-site Screw Down
- Nominal Thickness: 1.27mm (variable based on socket model and DUT thickness)
Lid Options
Universal array test sockets can utilize any of RTI’s standard lid designs but are typically used with low-profile screw-down and clip-on adjustable variations. For applications requiring visual access, lids equipped with Quartz or Sapphire glass windows are available and can be universal, provided all DUTs share the same nominal thickness.
However, devices with varying package thicknesses necessitate the use of device-specific lids to ensure proper fit and functionality. To facilitate rapid swapping of DUTs without the need for hand-screwing, clip-on adjustable lids serve as a versatile and universal replacement, streamlining the testing process and enhancing operational efficiency. Here are our most popular options:
Quartz or Sapphire Window Lids (WLCSP)
- Features: 100% visibility of WLCSP DUT surface. Applies even compression force, contacting DUT and alignment plate to distribute pressure evenly
- Mounting: 2-site or 4-site Screw Down, Removable
- Utility: Optical Inspection and Scanning (EMMI)
Open-Top Low-Profile (BGA)
- Features: Contacts perimeter of decapsulated devices for physical access to DIE and bond wires. Very low profile for use with tools that have limited clearance surrounding the socket
- Mounting: 2-site or 4-site Screw Down, Removable
- Utility: EMMI, MicroProbing, Forced Air Thermal, Optical Calibration, laser induced fault injection and Laser Voltage Probing
Dual-Latch Clip-On Removable
- Features: Dedicated and Universal Designs. Rapid swapping between DUTs
- Mounting: Dual-latch clip-on, Removable
- Utility: Hand test, prototyping, engineering, and optional openings for some designs. Universal clip-on removable lids used in conjunction with open-top low profile remove the need for screws by applying compression force between lid(s) and DUT
Dual-Hinge High Force Latching
- Features: Pivoting X/Y gimballed pressure plate for even, near-vertical force on DUT. Ease of use with high pin count and high insertion force test sockets.
- Mounting: 4-site Screw Down, Removable
- Utility: Mid-High volume hand test, prototyping, engineering, characterization, and ATE. Leverage provides high force with minimal operator effort (press of a single finger)
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