UNIVERSAL ARRAY TEST SOCKETS

#1 Cost-effective test socket solution when testing needs to be performed on multiple mid-high pin count packages within the same pitch. Reduce your cost of test by testing multiple high-pin count devices using the universal array test socket.

UNIVERSAL ARRAY SOCKET DESIGN

Designed for BGA, LGA, WLCSP, die level packages, and other arrayed IC packages that share a common pitch but differ in lead frame size. A device-agnostic socket base is produced for the maximum size array you require for devices with pitch down to 0.3mm. A device-specific alignment feature drops into the test socket nest and masks over the pin array leaving only the pins corresponding to the DUT footprint available. The alignment feature combined with the drilled holes in the floating base of the socket align and justify the DUT to the A1 corner of the pin array.

Universal Array Test Sockets Designed to Your Needs

One universal array socket base with 2 different alignment plates for different sizes of device footprints.

Our universal array test sockets are available in a variety of footprints based on the size of your DUT.  We use a pogo pin-based contact set manufactured to the largest anticipated array you require.

Devices of the same pitch but with fewer test pads are aligned to the A1 corner of the pin array using a device-specific alignment plate feature.

OEMs can take advantage of our universal test socket to test entire families of parts using a single socket rather than a device-specific test socket for each new package, ultimately reducing the cost-of-test.

We are not limited to designing test solutions for custom devices. Please contact us to discuss your project or start your design.

More Resources

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    Universal Socket Base

    • A device-agnostic floating base test socket is drilled and pinned for maximum required array size.   
    • BGA devices can roughly align to the pin array as solder balls sit in the drilled holes  
    • Interstitial drilling patterns are available  
    • Test sockets are compression mount and can be removed from the board for service or replacement 
    • Universal socket bases use high-performance long lasting pogo pins
      • Actual insertion life depends on test environment, regular cleaning of particle contaminants from pin tips, and recommended operation. 

    Device-Specific Alignment Features

    • Machined aluminum or plastic inserts include pockets that are machined to size based on DxE dimensions of the DUT 
    • Milled pocket in the alignment plate justifies ball A1 on the DUT with the upper left most hole in the universal array 
    • Quick swap alignment plates act as masks, blocking off all pogo pin contacts except those required by the DUT

    Universal and Device-Specific Lids

    • Open-top and closed-top low-profile lids for failure analysis are DUT specific and attach directly to the test socket via screws 
    • Quartz and Sapphire glass window lids may be universal depending on whether each DUT shares the same thickness  
    • Testing devices with varying package thicknesses requires device-specific lids 
    • Clip-on adjustable lids are a universal replacement for hand-screwing low-profile lids to the sockets. Ideal for rapid swapping of DUTs

    Universal Socket Base

    • A device-agnostic floating base test socket is drilled and pinned for maximum required array size.   
    • BGA devices can roughly align to the pin array as solder balls sit in the drilled holes  
    • Interstitial drilling patterns are available  
    • Test sockets are compression mount and can be removed from the board for service or replacement 
    • Universal socket bases use high-performance long lasting pogo pins
      • Actual insertion life depends on test environment, regular cleaning of particle contaminants from pin tips, and recommended operation. 

    Device-Specific Alignment Features

    • Machined aluminum or plastic inserts include pockets that are machined to size based on DxE dimensions of the DUT 
    • Milled pocket in the alignment plate justifies ball A1 on the DUT with the upper left most hole in the universal array 
    • Quick swap alignment plates act as masks, blocking off all pogo pin contacts except those required by the DUT

    Universal and Device-Specific Lids

    • Open-top and closed-top low-profile lids for failure analysis are DUT specific and attach directly to the test socket via screws 
    • Quartz and Sapphire glass window lids may be universal depending on whether each DUT shares the same thickness  
    • Testing devices with varying package thicknesses requires device-specific lids 
    • Clip-on adjustable lids are a universal replacement for hand-screwing low-profile lids to the sockets. Ideal for rapid swapping of DUTs

    Design & Concept Gallery

    MORE SOCKET SOLUTIONS

    Bare Die & IC Test Sockets

    For BGA, QFN, WLCSP, PGA, QFP, TSSOP and other packaged device types.  Compatible with a variety of RTI’s socket lids based on your test application.

    PCB Module Test Sockets

    For small PCB sub-assemblies and multi-chip modules. Providing precise DUT alignment with relief cutouts for SMT components and more.

    PGA LGA image sensor socket

    Image Sensor Test Sockets

    For large-scale CMOS image sensors in ceramic packages to small cameras mounted to flex PCB’s.

    Cartridge Carriers & Test Sockets

    For small and fragile wafer-level devices that are prone to handling issues between test platforms.  Multi-site and single-site test socket configurations.

    Flat Top Socket Convertible for use with packaged devices, WLCSP

    FTSC Sockets

    Flat-top socket convertible sockets are a dedicated solution designed for the carrier/coupon boards with the pogo pin array specified to the packaged device.

    Universal Array Test Sockets

    For groups of BGA devices that share a common pitch but different physical dimensions. A device specific alignment plate justifies A1 to upper left corner.

    QUALITY GUARANTEE

    Robson Technologies, Inc. interconnects, fixtures and systems are carefully designed, manufactured, inspected, and individually tested prior to shipment. In the unlikely case you find a defect in materials or workmanship, we will promptly repair or replace the component.

    CONTACT US

    Do you need help finding a test solution? Get in touch with an RTI Engineer!

    OFFICE LINE

    1.408.779.8008

    EMAIL

    rtisales@testfixtures.com

    OFFICE HOURS

    8:00am – 5:00pm PT

    OFFICE LINE

    EMAIL

    rtisales@testfixtures.com

    OFFICE HOURS

    8:00am – 5:00pm PT