High Speed Breakout Boards & Test Fixtures

Our high-speed breakout boards and fixtures are engineered to ensure seamless signal integrity across high-frequency applications, essential for precise evaluation and validation of cutting-edge ICs. These fixtures feature shielded connections and durable PCB designs that cater to the demanding requirements of high-speed testing environments.

Common test sockets include BGA, QFN, and LGA, with elastomeric and spring pin contacts optimized for minimal signal distortion. The PCB design focuses on controlled impedance and high-quality trace routing, ensuring low insertion loss and minimal crosstalk. Signals are routed to high-speed interfaces like BNC, Triax, and other SMA, SMP, and 2.92mm (K) Coax connectors.

Our breakout boards and fixtures work with a variety of bench test equipment, including vector network analyzers, spectrum and impedance analyzers, oscilloscopes and more, making them a single versatile solution for multiple testing scenarios. The robust assemblies with sensible designs for ease of use ensure reliable connections during repeated testing cycles, making them ideal for both benchtop and automated test systems. Designed with input from experienced test engineers, our high-speed breakout boards provide the accuracy and consistency needed to meet stringent industry standards.

Failure Analysis Test Fixtures

Featuring low profile and compact form factors to observe tight working areas while providing the greatest level of device access during test and inspection. Instrumental in fault localization towards root-cause failure, these mobile fixtures can be used with high end inspection tools while connected to popular benchtop measurement tools. See our 950 Series and RSK Series fixtures for additional standardized designs.

• Physical Customization: Fully assembled IC test fixtures for failure analysis are customized to fit on your bench or mount directly to your advanced inspection tools. All fixtures are designed provide precision alignment at every stage between the DUT and inspection tool, crucial for accurately identifying defects or anomalies at the nano scale. See our semi-custom test sockets for FA centric design options that give you greater working areas, bring your device in contact with Solid Immersion Lenses, provide full surface visibility to your WLCSP packages, and more.
• Thermal Control: Integrated device level heatsinks and heater blocks let you test at elevated temperatures to introduce stress, monitor heat distribution and detect overheating issues within the die.
• Support for Mounting Brackets: For use on common stages, backplates for vacuum chucks, or within X-Ray or EMMI scopes, RTI fixtures sit securely in place while you perform high resolution and delicate measurements on the DUT.
• Automated System Compatibility: Integrates with MultiTrace automated curve tracers and other diagnostic systems for enhanced analysis efficiency.

Some common FA inspection methods our fixtures are designed for include:

• Scanning Electron Microscopes (SEMs): SEMs provide high-resolution imaging for detailed examination of semiconductor devices. Direct mounting of test sockets and PCBs allows for precise positioning and stable imaging, crucial for identifying minute defects or irregularities in materials.
• Focused Ion Beam Systems (FIBs): FIB systems are used for both imaging and material modification at the micro and nano scale. They require the DUT to be securely mounted to ensure precision during cross-sectioning or circuit editing.
• Probe Stations: Used for electrical probing of semiconductor devices, probe stations require direct mounting of PCBs and test sockets to facilitate stable and accurate contact with the device under test. These are commonly used in conjunction with microscopes or RF measurement tools.
• X-ray Inspection Systems (e.g., X-ray Tomography): X-ray systems are used to inspect the internal structure of semiconductor devices without damaging them. Direct mounting ensures that the DUT is securely held in place for accurate 3D imaging and defect analysis.